SNVSA40B October   2014  – June 2024 TPS61169

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Soft Start-Up
      2. 6.3.2 Open LED Protection
      3. 6.3.3 Shutdown
      4. 6.3.4 Current Program
      5. 6.3.5 LED Brightness Dimming
      6. 6.3.6 Undervoltage Lockout
      7. 6.3.7 Thermal Foldback and Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Operation With CTRL
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Inductor Selection
        2. 7.2.2.2 Schottky Diode Selection
        3. 7.2.2.3 Output Capacitor Selection
        4. 7.2.2.4 LED Current Set Resistor
        5. 7.2.2.5 Thermal Considerations
    3. 7.3 Application Curves
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.7 Thermal Foldback and Thermal Shutdown

When TPS61169 drives heavy load for large size panel applications, the power dissipation increases a lot and the device junction temperature may reach a very high value, affecting the device function and reliability. In order to lower the thermal stress, the TPS61169 features a thermal foldback function. When the junction temperature is higher than 100°C, the switch current limit ILIM is reduced automatically as Figure 5-2 shows. This thermal foldback mechanism controls the power dissipation and keeps the junction temperature from rising to a very high value. If the typical junction temperature of 160°C is exceeded, an internal thermal shutdown turns off the device. The device is released from shutdown automatically when the junction temperature decreases by 15°C.