SLVSAX2B September   2011  – June 2020 TPS61170-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start-up
      2. 7.3.2 Overcurrent Protection
      3. 7.3.3 Undervoltage Lockout
      4. 7.3.4 Thermal Shutdown
      5. 7.3.5 Enable and Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Program Mode
      2. 7.4.2 1-Wire Program Mode
      3. 7.4.3 EasyScale
    5. 7.5 Programming
      1. 7.5.1 Feedback Reference Program Mode Selection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 12-V to 24-V DC-DC Power Conversion
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Program Output Voltage
          2. 8.2.1.2.2 Maximum Output Current
          3. 8.2.1.2.3 Switch Duty Cycle
          4. 8.2.1.2.4 Inductor Selection
          5. 8.2.1.2.5 Schottky Diode Selection
          6. 8.2.1.2.6 Compensation Capacitor Selection
          7. 8.2.1.2.7 Input and Output Capacitor Selection
        3. 8.2.1.3 Application Curve
      2. 8.2.2 5-V to 12-V DC-DC Power Conversion With Programmable Feedback Reference Voltage
      3. 8.2.3 12-V SEPIC (Buck-Boost) Converter
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS61170-Q1 UNIT
DRV (SON)
6 PINS
RθJA Junction-to-ambient thermal resistance 96.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 89 °C/W
RθJB Junction-to-board thermal resistance 65.9 °C/W
ψJT Junction-to-top characterization parameter 3.2 °C/W
ψJB Junction-to-board characterization parameter 66.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 40.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.