The TPS61170 is a monolithic, high-voltage switching regulator with integrated 1.2-A, 40-V power MOSFET. The device can be configured in several standard switching-regulator topologies, including boost and SEPIC. The device has a wide input-voltage range to support applications with input voltage from multicell batteries or regulated 5-V, 12-V power rails.
The TPS61170 operates at a 1.2-MHz switching frequency, allowing the use of low-profile inductors and low-value ceramic input and output capacitors. External loop compensation components give the user flexibility to optimize loop compensation and transient response. The device has built-in protection features, such as pulse-by-pulse overcurrent limit, soft start, and thermal shutdown.
The FB pin regulates to a reference voltage of 1.229 V. The reference voltage can be lowered using a 1-wire digital interface (Easyscale™ protocol) through the CTRL pin. Alternatively, a pulse width-modulation (PWM) signal can be applied to the CTRL pin. The duty cycle of the signal reduces the feedback reference voltage proportionally.
The TPS61170 is available in a 6-pin 2-mm × 2-mm QFN package, allowing a compact power-supply solution.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
---|---|---|
TPS61170 | VSON (6) | 2.00 mm x 2.00 mm |
Changes from C Revision (April 2011) to D Revision
Changes from B Revision (November 2009) to C Revision
PIN | I/O | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
COMP | 2 | O | Output of the transconductance error amplifier. Connect an external RC network to this pin to compensate the regulator. |
CTRL | 5 | I | Control pin of the boost regulator. CTRL is a multifunctional pin which can be used to enable the device and control the feedback voltage with a PWM signal or for digital communications. |
FB | 1 | I | Feedback pin for current. Connect to the center tap of a resistor divider to program the output voltage. |
GND | 3 | O | Ground |
SW | 4 | I | This is the switching node of the IC. Connect SW to the switched side of the inductor. |
Thermal Pad | The thermal pad should be soldered to the analog ground plane to avoid thermal issue. If possible, use thermal vias to connect to ground plane for ideal power dissipation. | ||
VIN | 6 | I | The input supply pin for the IC. Connect VIN to a supply voltage from 3 V to 18 V. |