SLVSCN9B December   2014  – June 2020 TPS61175-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switching Frequency
      2. 7.3.2 Soft Start
      3. 7.3.3 Overcurrent Protection
      4. 7.3.4 Enable and Thermal Shutdown
      5. 7.3.5 Under Voltage Lockout (UVLO)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Minimum ON Time and Pulse Skipping
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Determining the Duty Cycle
        2. 8.2.2.2 Selecting the Inductor
        3. 8.2.2.3 Computing the Maximum Output Current
        4. 8.2.2.4 Setting Output Voltage
        5. 8.2.2.5 Setting the Switching Frequency
        6. 8.2.2.6 Setting the Soft Start Time
        7. 8.2.2.7 Selecting the Schottky Diode
        8. 8.2.2.8 Selecting the Input and Output Capacitors
        9. 8.2.2.9 Compensating the Small Signal Control Loop
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Considerations

The maximum IC junction temperature should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation of the TPS61175-Q1. Calculate the maximum allowable dissipation, PD(max), and keep the actual dissipation less than or equal to PD(max). The maximum-power-dissipation limit is determined using the following equation:

Equation 23. TPS61175-Q1 eq_pd_lvs892.gif

where, TA is the maximum ambient temperature for the application. RθJA is the thermal resistance junction-to-ambient given in the Thermal Information table.

The TPS61175-Q1 comes in a thermally enhanced TSSOP package. This package includes a thermal pad that improves the thermal capabilities of the package. The RθJA of the TSSOP package greatly depends on the PCB layout and thermal pad connection. The thermal pad must be soldered to the analog ground on the PCB. Using thermal vias underneath the thermal pad.