SNVSA76B March   2015  – March 2017 TPS61177A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Supply Voltage
      2. 7.3.2  Boost Regulator
      3. 7.3.3  Programmable Switch Frequency and Slew Rate
      4. 7.3.4  LED Current Sinks
      5. 7.3.5  Enable and Start-Up Timing
      6. 7.3.6  Input Undervoltage Protection (UVLO)
      7. 7.3.7  Overvoltage Protection (OVP)
      8. 7.3.8  Current-Sink Open Protection
      9. 7.3.9  Overcurrent Protection
      10. 7.3.10 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mode Selection
      2. 7.4.2 Analog and PWM Mixed Dimming Mode
      3. 7.4.3 Analog Dimming Mode
      4. 7.4.4 Direct PWM Dimming
    5. 7.5 Programming
      1. 7.5.1 Configuration Parameters
    6. 7.6 Register Maps
      1. 7.6.1  MODE (A0h)
      2. 7.6.2  CS (A1h)
      3. 7.6.3  UVLO (A2h)
      4. 7.6.4  FREQ (A3h)
      5. 7.6.5  SR (A4h)
      6. 7.6.6  ILIM (A5h)
      7. 7.6.7  Control (FFh)
      8. 7.6.8  Example - Writing to a Single RAM Register
      9. 7.6.9  Example - Writing to Multiple RAM Registers
      10. 7.6.10 Example - Saving Contents of all RAM Registers to E2PROM
      11. 7.6.11 Example - Reading from a Single RAM Register
      12. 7.6.12 Example - Reading from a Single E2PROM Register
      13. 7.6.13 Example - Reading from Multiple RAM Registers
      14. 7.6.14 Example - Reading from Multiple E2PROM Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 CS Pin Unused
      2. 8.1.2 Brightness Dimming Control
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (March 2016) to B Revision

  • Changed layout example picture to show Vout connected to pin 14 of the device, not pin 13Go

Changes from * Revision (March 2015) to A Revision

  • Added several items to "Applications" on page 1 Go