SLVS776B January   2009  – November 2014 TPS61220 , TPS61221 , TPS61222

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Controller Circuit
      2. 9.3.2 Device Enable And Shutdown Mode
      3. 9.3.3 Startup
      4. 9.3.4 Operation At Output Overload
      5. 9.3.5 Undervoltage Lockout
      6. 9.3.6 Overvoltage Protection
      7. 9.3.7 Overtemperature Protection
    4. 9.4 Device Functional Modes
  10. 10Applications and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Specific Application, Fixed Output Voltage Supply
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Device Choice
          2. 10.2.1.2.2 Programming The Output Voltage
          3. 10.2.1.2.3 Inductor Selection
          4. 10.2.1.2.4 Capacitor Selection
            1. 10.2.1.2.4.1 Input Capacitor
            2. 10.2.1.2.4.2 Output Capacitor
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Specific Application, Variable Output Voltage Supply
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Device Selection
          2. 10.2.2.2.2 Programming The Output Voltage
          3. 10.2.2.2.3 Inductor Selection
          4. 10.2.2.2.4 Capacitor Selection
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Typical Power Sources
    2. 11.2 Input Voltage Effects On Output Current and Efficiency
    3. 11.3 Behavior While Disabled
    4. 11.4 Startup
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
      2. 13.1.2 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.1.2 Development Support

TPS61220EVM-319 Evaluation Module

SwitcherPro Switching Power Supply Design Tool (Circuit Design & Simulation)

13.2 Documentation Support

13.2.1 Related Documentation

Gas Sensor Platform Reference Design

Wireless Heart Monitor with Bluetooth Low Energy

13.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 3. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS61220 Click here Click here Click here Click here Click here
TPS61221 Click here Click here Click here Click here Click here
TPS61222 Click here Click here Click here Click here Click here

13.4 Trademarks

SwitcherPro is a trademark of TI.

All other trademarks are the property of their respective owners.

13.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.