SLVSAO4C December   2010  – June 2020 TPS61240-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current Limit Operation
      2. 7.3.2 Undervoltage Lockout
      3. 7.3.3 Input Overvoltage Protection
      4. 7.3.4 Enable
      5. 7.3.5 Soft Start
      6. 7.3.6 Load Disconnect
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Output Voltage
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Input Capacitor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Checking Loop Stability
      3. 8.2.3 Application Curves
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

Over full operating ambient temperature range with typical values at TA = 25°C. Specifications apply for condition VIN = EN = 3.6 V (unless otherwise noted). External components CIN = 2.2 μF, COUT = 4.7 μF (0603), and L = 1μH (refer to Typical Applications section).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC/DC STAGE
VIN Input voltage range 2.3 5.5 V
VOUT Fixed output voltage range 2.3 V ≤ VIN ≤ VOUT, 0 mA ≤ IOUT ≤ 200 mA 4.9 5 5.1 V
VO_Ripple Ripple voltage, PWM mode ILOAD = 150 mA 20 mVpp
Output current VIN = 2.3 V to 5.5 V 200 mA
ISW Switch valley current limit VOUT = VGS = 5 V 500 600 mA
Short circuit current VOUT = VGS = 5 V 200 350 mApk
High side MOSFET
on-resistance(1) 		VIN = VGS = 5 V, TA = 25°C(1) 290 mΩ
Low Side MOSFET
on-resistance(1) 		VIN = VGS = 5 V, TA = 25°C(1) 250 mΩ
Operating quiescent current IOUT = 0 mA, power save mode, device not switching 30 40 μA
Shutdown current TPS61240IDRVRQ1, EN = GND 1.5 μA
TPS61240TDRVRQ1, EN = GND 2.5
Reverse leakage current VOUT EN = 0 V, VOUT = 5 V 2.5 μA
Leakage current from battery
to VOUT 		EN = GND 2.5 μA
Line transient response VIN = 600 mVp-p AC square wave, 200 Hz,
12.5% DC at 50 mA or 200 mA load 		±25 ±50 mVpk
Load transient response 0 mA to 50 mA, 50 mA to 0 mA, VIN = 3.6 V,
TRise = TFall = 0.1 μs 		50 mVpk
50 mA to 200 mA, 200 mA to 50 mA, VIN = 3.6 V,
TRise = TFall = 0.1 μs		 150
IIN Input bias current, EN EN = GND or VIN 0.01 1.0 μA
VUVLO Undervoltage lockout threshold Falling 2.0 2.1 V
Rising 2.1 2.2 V
CONTROL STAGE
VIH High level input voltage, EN 2.3 V ≤ VIN ≤ 5.5 V 1.0 V
VIL Low level input voltage, EN 2.3 V ≤ VIN ≤ 5.5 V 0.4 V
OVC Input over-voltage threshold Falling 5.9 V
Rising 6
tStart Start-up time Time from active EN to start switching, no-load until VOUT is stable 5 V 300 μs
DC/DC STAGE
Freq See Figure 7 3.5 MHz
TSD Thermal shutdown Increasing junction temperature 140 °C
Thermal shutdown hysteresis Decreasing junction temperature 20 °C
(1) DRV package has an increased RDSon of about 40 mΩ due to bond wire resistance.