SLVSB07A July   2011  – March 2018 TPS61256A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Smallest Solution Size Application
      2.      Efficiency vs. Load Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Softstart
    3. 8.3 Undervoltage Lockout
    4. 8.4 Thermal Regulation
    5. 8.5 Thermal Shutdown
    6. 8.6 Functional Block Diagram
    7. 8.7 Feature Description
      1. 8.7.1 Power-Save Mode
      2. 8.7.2 Current Limit Operation
      3. 8.7.3 Enable
      4. 8.7.4 Load Disconnect And Reverse Current Protection
    8. 8.8 Device Functional Modes
      1. 8.8.1 Load Disconnect And Reverse Current Protection
      2. 8.8.2 Softstart
      3. 8.8.3 Undervoltage Lockout
      4. 8.8.4 Thermal Regulation
      5. 8.8.5 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
          1. 9.2.2.1.1 High-frequency Converter Applications
        2. 9.2.2.2 Output Capacitor
        3. 9.2.2.3 Input Capacitor
        4. 9.2.2.4 Checking Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Information
  12. 12Package Summary
    1. 12.1 Package Dimensions
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.3 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below:

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow in the system

Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. The maximum junction temperature (TJ) of the TPS61256A is 125°C.