SLVSEA0B january   2018  – june 2023 TPS61280D , TPS61280E , TPS61281D

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 I2C Interface Timing Characteristics #GUID-BD85FD7C-B9AF-4F5D-9DFF-CD61365A592A/SLVS5401494
    7. 8.7 I2C Timing Diagrams
    8. 8.8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Voltage Scaling Management (VSEL)
      2. 9.3.2 Spread Spectrum, PWM Frequency Dithering
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Save Mode
      2. 9.4.2 Pass-Through Mode
      3. 9.4.3 Mode Selection
      4. 9.4.4 Current Limit Operation
      5. 9.4.5 Start-Up and Shutdown Mode
      6. 9.4.6 Undervoltage Lockout
      7. 9.4.7 Thermal Shutdown
      8. 9.4.8 Fault State and Power-Good
    5. 9.5 Programming
      1. 9.5.1 Serial Interface Description (TPS61280D/E)
      2. 9.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 9.5.3 HS-Mode Protocol
      4. 9.5.4 TPS6128xD/E I2C Update Sequence
    6. 9.6 Register Maps
      1. 9.6.1  Slave Address Byte
      2. 9.6.2  Register Address Byte
      3. 9.6.3  I2C Registers, E2PROM, Write Protect
      4. 9.6.4  E2PROM Configuration Parameters
      5. 9.6.5  CONFIG Register [reset = 0x01]
      6. 9.6.6  VOUTFLOORSET Register [reset = 0x02]
      7. 9.6.7  VOUTROOFSET Register [reset = 0x03]
      8. 9.6.8  ILIMSET Register [reset = 0x04]
      9. 9.6.9  Status Register [reset = 0x05]
      10. 9.6.10 E2PROMCTRL Register [reset = 0xFF]
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 TPS61281D with 2.5V-4.35 VIN, 1500 mA Output Current (TPS61280D with default I2C Configuration)
        1. 10.2.1.1 Design Requirement
        2. 10.2.1.2 Detailed Design Parameters
          1. 10.2.1.2.1 Inductor Selection
          2. 10.2.1.2.2 Output Capacitor
          3. 10.2.1.2.3 Input Capacitor
          4. 10.2.1.2.4 Checking Loop Stability
        3. 10.2.1.3 Application Performance Curves
      2. 10.2.2 TPS61282D with 2.5V-4.35 VIN, 2000 mA Output Current (TPS61280D with I2C Programmable)
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedures
        3. 10.2.2.3 Application Performance Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Information
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Summary

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
Input voltageVoltage at VOUT (boost mode)(2)DC–0.34.7V
Voltage at VOUT (by pass mode)(2) DC -0.3 5.2 V
Voltage at VIN(2), EN(2), VSEL(2), BYP(2), PG(2), GPIO(2)DC–0.35.2V
Voltage at SCL(2), SDA(2)MODE(2)DC–0.33.6V
Voltage at SW(2)DC–0.35.2V
Transient: 2 ns, 2.3 MHz–0.35.5V
Differential voltage between VIN and VOUTDC–0.34V
Differential voltage between SW and VOUT DC –0.3 4.7 V
Input currentContinuous average current into SW (4)1.8A
Peak current into SW (5)5.5A
Power dissipationInternally limited
Temperature rangeOperating temperature range, TA (3)–4085°C
Operating virtual junction, TJ–40150°C
TstgStorage temperature range–65150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to network ground terminal.
(3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA X PD(max)). To achieve optimum performance, it is recommended to operate the device with a maximum junction temperature of 105°C.
(4) Limit the junction temperature to 105°C for continuous operation at maximum output power.
(5) Limit the junction temperature to 105°C for 15% duty cycle operation.