SLVSHB5A October   2024  – November 2024 TPS61287

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Enable and Start-up
      2. 6.3.2 Undervoltage Lockout (UVLO)
      3. 6.3.3 Programmable EN/UVLO
      4. 6.3.4 Switching Valley Current Limit
      5. 6.3.5 External Clock Synchronization
      6. 6.3.6 Stackable Multi-phase Operation
      7. 6.3.7 Device Functional Modes
        1. 6.3.7.1 Forced PWM Mode
        2. 6.3.7.2 Auto PFM Mode
      8. 6.3.8 Overvoltage Protection
      9. 6.3.9 Thermal Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Setting Output Voltage
        2. 7.2.2.2 Inductor Selection
        3. 7.2.2.3 Bootstrap And VCC Capacitors Selection
        4. 7.2.2.4 MOSFET Selection
        5. 7.2.2.5 Input Capacitor Selection
        6. 7.2.2.6 Output Capacitor Selection
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.9 Thermal Shutdown

The thermal shutdown is implemented to prevent damage from excessive heat and power dissipation. Typically, the thermal shutdown occurs when junction temperatures exceeding 160°C (typical). If the thermal shutdown is triggered, the device stops switching and recovers when the junction temperature drops below 140°C (typical).