SLVSFP3C August   2020  – March 2022 TPS61288

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable and Start-up
      2. 8.3.2 Undervoltage Lockout (UVLO)
      3. 8.3.3 Switching Peak Current Limit
      4. 8.3.4 Overvoltage Protection
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 PWM
      2. 8.4.2 PFM
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting Output Voltage
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Loop Stability
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS61288 TPS61288 UNIT
RQQ (VQFN) - 11 PINS RQQ (VQFN) - 11 PINS
EVM(2) Standard
RθJA Junction-to-ambient thermal resistance 33.6 71.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance n/a n/a °C/W
RθJB Junction-to-board thermal resistance n/a n/a °C/W
ΨJT Junction-to-top characterization parameter 1.7 2.7 °C/W
ΨJB Junction-to-board characterization parameter 13.4 15.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on TPS61288EVM, 4-layer, 2oz copper PCB.