SLVSBX9A September   2014  – September 2014 TPS61291

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bypass / Boost Mode Operation EN/BYP
      2. 7.3.2 Output Voltage Selection VSEL
      3. 7.3.3 Feedback Divider Disconnect
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Overtemperature Protection
      6. 7.3.6 Overvoltage Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Boost Mode Operation
      2. 7.4.2 Bypass Mode Operation
      3. 7.4.3 Controlled Transition into Bypass Mode
      4. 7.4.4 Operation at Output Overload
      5. 7.4.5 Startup
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input and Output Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Pin Voltage Range (2) VIN -0.3 5.5 V
SW -0.3 7
EN/BYP, VOUT -0.3 5.5
VSEL -0.3 VOUT + 0.3V
Output Current In Bypass Operation (EN/BYP = GND) 250 mA
TJ Maximum Junction Temperature -40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal GND.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
V(ESD) Electrostatic discharge Human body model (HBM) per ANSI/ESDA/JEDEC JS-001, all pins(1) -2 2 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) -0.5 0.5
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN Supply voltage for startup 1.5 V
Supply voltage range (once device has started) 0.9 5
Supply voltage range for step up conversion (once device has started) 0.9 VOUT
TA Operating ambient temperature -40 85 °C
TJ Operating junction temperature –40 125

6.4 Thermal Information

THERMAL METRIC(1) TPS61291 UNIT
DRV (2x2 SON)
6 PINS
RθJA Junction-to-ambient thermal resistance 71.2 °C/W
RθJCtop Junction-to-case (top) thermal resistance 93.5
RθJB Junction-to-board thermal resistance 46.7
ψJT Junction-to-top characterization parameter 2.5
ψJB Junction-to-board characterization parameter 41.1
RθJCbot Junction-to-case (bottom) thermal resistance 11.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

TA = –40°C to 85°C. Typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
VIN Startup voltage VOUT = 3.3V, IOUT = 20mA 1.5 V
Input voltage range Operating voltage range 0.9 5
IQ Quiescent current in boost mode VIN IOUT = 0 mA, VEN/BYP = VIN = 1.8 V, VOUT = 3.3V, device not switching 0.4 1.5 μA
VOUT 5.7 9
Quiescent current in bypass mode VIN VEN/BYP = low, VIN = 3 V, IOUT = 0 mA 0.015 0.5
ILkSW Leakage current into SW VEN/BYP = low, VIN = 1.2 V, VSW = 1.2 V 0.01 0.5 μA
VUVLO Undervoltage lockout threshold VIN decreasing 0.65 0.9 V
Overtemperature protection TJ rising 140 °C
Overtemperature hysteresis 20 °C
INPUTS
IIN EN/BYP, input current EN/BYP = low or EN/BYP = VIN 0.01 0.1 μA
VIL EN/BYP, input low voltage VIN ≤ 1.5 V 0.2 × VIN V
5 V > VIN > 1.5 V 0.3
VIH EN/BYP, input high voltage VIN ≤ 1.5 V 0.8 × VIN V
5 V > VIN > 1.5 V 1.2
VIL VSEL, input low voltage VEN/BYP = high 0.3 V
VIH VSEL, input high voltage VEN/BYP = high VOUT - 0.3 V
IIN VSEL, input current VEN/BYP = high, VSEL = VOUT = 3V 0.01 0.1 μA
POWER SWITCHES
RDS(ON) Rectifying switch on resistance VOUT = 3.3 V 0.6 Ω
Main switch on resistance VOUT = 3.3 V 0.4 Ω
Bypass switch on resistance VIN = 1.8V, IOUT = 50 mA, EN/BYP = low 1.2 Ω
ISW Switch current limit VOUT = 3.3V 700 1000 1300 mA
OUTPUT
VOUT Output voltage accuracy VIN = 1.8V, IOUT = 10 mA, VOUT 3.3V, 3.0V, 2.5V, EN/BYP = high -2 +1 +4 %
Line regulation VOUT = 3.3V, VIN = 2V to 3.0V, IOUT = 50 mA, EN/BYP = high +0.15 %/V
Load regulation VIN = 2V, VOUT = 3.3V, IOUT = 1 mA to 200 mA, EN/BYP = high -0.007 %/mA
VOVP Output overvoltage protection VOUT rising, EN/BYP = high 5.4 V

6.6 Typical Characteristics

ATE_IQ_Bypass_Vs_temp.gif
EN/BYP = low VSEL = low IOUT = 0mA
Figure 1. Quiescent Current IQ into VIN Pin in Bypass Mode
ATE_IQ_VOUT_vs_temp.gif
EN/BYP = high Boost mode operation
IOUT = 0mA Device not switching
Figure 3. Quiescent Current IQ into VOUT Pin in Boost Mode
ATE_RDSON_Main_switch_vs_temp.gif
VOUT = 3.3V
Figure 5. RDSON Main Switch
ATE_IN_vs_temp.gif
EN/BYP = high Boost mode operation
Device not switching
Figure 2. Quiescent Current IQ into VIN Pin in Boost Mode
ATE_RDSON_Byp_vs_temp.gif
Figure 4. RDSON Bypass Switch
ATE_RDSON_rect_switch_vs_temp.gif
VOUT = 3.3V
Figure 6. RDSON Rectifier Switch