SLVS978D March   2010  – September 2016 TPS61310 , TPS61311

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Interface Timing Requirements
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Privacy Indicator
        1. 9.3.1.1 Dedicated LED Privacy Indicator
        2. 9.3.1.2 White LED Privacy Indicator
      2. 9.3.2 Safe Operation and Protection Features
        1. 9.3.2.1 LED Temperature Monitoring (Finger-Burn Protection)
        2. 9.3.2.2 LED Failure Modes (Open and Short Detection) and Overvoltage Protection
          1. 9.3.2.2.1 LED Open Circuit Detection and Overvoltage Protection
          2. 9.3.2.2.2 Short-Circuit Protection
        3. 9.3.2.3 LED Current Ramp-Up and Ramp-Down
        4. 9.3.2.4 Battery Voltage Droop Monitoring and Protection
        5. 9.3.2.5 Undervoltage Lockout
        6. 9.3.2.6 Hot Die Detection and Thermal Shutdown
        7. 9.3.2.7 Current Limit
        8. 9.3.2.8 Flash Blanking (Tx-Mask) for Instantaneous Flash Current Reduction
      3. 9.3.3 Start-Up Sequence
      4. 9.3.4 NRESET Input: Hardware Enable or Disable
      5. 9.3.5 Serial Interface Description
        1. 9.3.5.1 F/S-Mode Protocol
        2. 9.3.5.2 H/S-Mode Protocol
        3. 9.3.5.3 TPS6131x I2C Update Sequence
        4. 9.3.5.4 Slave Address Byte
        5. 9.3.5.5 Register Address Byte
      6. 9.3.6 LED Forward Voltage Calibration
    4. 9.4 Device Functional Modes
      1. 9.4.1 Video Light and Flash Strobe Operation
        1. 9.4.1.1 LED Hardware Setup
        2. 9.4.1.2 Triggering Video Light and Flash
        3. 9.4.1.3 Level-Sensitive Flash Trigger (STT = 0)
        4. 9.4.1.4 Rising-Edge Flash Trigger (STT = 1)
      2. 9.4.2 Voltage Mode
        1. 9.4.2.1 Down Mode in Voltage Mode Operation
        2. 9.4.2.2 Power Good Indication
      3. 9.4.3 Power-Save Mode Operation, Efficiency
      4. 9.4.4 Shutdown
    5. 9.5 Register Maps
      1. 9.5.1 REGISTER0 (address = 0x00)
      2. 9.5.2 REGISTER1 (address = 0x01)
      3. 9.5.3 REGISTER2 (address = 0x02)
      4. 9.5.4 REGISTER3 (address = 0x03)
      5. 9.5.5 REGISTER4 (address = 0x04)
      6. 9.5.6 REGISTER5 (address = 0x05)
      7. 9.5.7 REGISTER6 (address = 0x06)
      8. 9.5.8 REGISTER7 (address = 0x07)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 2x 600-mA High Power White LED Solution Featuring Privacy Indicator
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Inductor Selection
          2. 10.2.1.2.2 Input Capacitor
          3. 10.2.1.2.3 Output Capacitor
          4. 10.2.1.2.4 NTC Selection
          5. 10.2.1.2.5 Checking Loop Stability
          6. 10.2.1.2.6 LED Flash Current Level Optimization Versus Battery Droop
        3. 10.2.1.3 Application Curves
      2. 10.2.2 1200-mA High Power White LED Solution Featuring Voltage Mode
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

UM10204, I2C-Bus Specification and User Manual; (Rev. 6, April 2014),

http://www.nxp.com/documents/user_manual/UM10204.pdf

13.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 18. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS61310 Click here Click here Click here Click here Click here
TPS61311 Click here Click here Click here Click here Click here

13.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 Trademarks

NanoFree, E2E are trademarks of Texas Instruments.

I2C is a trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.