SLVSDY5E January   2018  – February 2024 TPS61322

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Boost Controller Circuit
      3. 7.3.3 21
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Current Limit Operation
      6. 7.3.6 Overtemperature Protection
      7. 7.3.7 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Boost without Schottky Diode
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Maximum Output Current
          3. 8.2.1.2.3 Inductor Selection
          4. 8.2.1.2.4 35
          5. 8.2.1.2.5 Capacitor Selection
          6. 8.2.1.2.6 37
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Boost with Schottky Diode
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Inductor Selection
          2. 8.2.2.2.2 Schottky Diode Selection
          3. 8.2.2.2.3 Capacitor Selection
        3. 8.2.2.3 Application Curves
    3. 8.3 System Examples
      1. 8.3.1 Detail Design Schematics
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  12. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS61322UNIT
DBZ (SOT-23)DBV (SOT-23)
3-PIN5-PIN
RθJAJunction-to-ambient thermal resistance322.2189.7°C/W
RθJC(top)Junction-to-case (top) thermal resistance107.0109.4°C/W
RθJBJunction-to-board thermal resistance65.856.5°C/W
ψJTJunction-to-top characterization parameter7.533.3°C/W
ψJBJunction-to-board characterization parameter64.556.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.