SLVSFE7 November   2019 TPS61391

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Circuit
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Recommended Operating Conditions
    2. 6.2 Absolute Maximum Ratings
    3. 6.3 ESD Ratings
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Disable
      3. 7.3.3 Current Mirror
      4. 7.3.4 High Optical Power Protection
    4. 7.4 Device Functional Mode
      1. 7.4.1 PFM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirement
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Rectifier Diode
        2. 8.2.2.2  Selecting the Inductor
        3. 8.2.2.3  Selecting Output Capacitor
        4. 8.2.2.4  Selecting Filter Resistor and Capacitor
        5. 8.2.2.5  Setting the Output Voltage
        6. 8.2.2.6  Selecting Capacitor for CAP pin
        7. 8.2.2.7  Selecting Capacitor for AVCC pin
        8. 8.2.2.8  Selecting Capacitor for APD pin
        9. 8.2.2.9  Selecting the Resistors of MON1 or MON2
        10. 8.2.2.10 Selecting the Capacitors of MON1 or MON2
        11. 8.2.2.11 Selecting the Short Current Limit
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
      1. 12.1.1 Packaging Information
      2. 12.1.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

The basic PCB board layout requires a separation of sensitive signal and power paths. If the layout is not carefully done, the regulator could suffer from the instability or noise problems. Use the following checklist to get good performance for a well-designed board:

  • Minimize the high current path including the switch FET, rectifier FET, and the output capacitor. This loop contains high di / dt switching currents (nano seconds per ampere) and easy to transduce the high frequency noise;
  • Place the noise sensitive network like current mirror output (MON1, MON2) being far away from the SW trace;
  • Split the ground for the power GND, signal GND. Use a separate ground trace to connect the current monitor and boost circuitry. Connect this ground trace to the main power ground at a single point to minimize circulating currents.