SLVSC55C August   2013  – November 2021 TPS62090-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Enable and Disable (EN)
      2. 7.3.2  Soft Start (SS) and Hiccup Current Limit During Start-Up
      3. 7.3.3  Voltage Tracking (SS)
      4. 7.3.4  Short-Circuit Protection (Hiccup Mode)
      5. 7.3.5  Output Discharge Function
      6. 7.3.6  Power Good Output (PG)
      7. 7.3.7  Frequency Set Pin (FREQ)
      8. 7.3.8  Undervoltage Lockout (UVLO)
      9. 7.3.9  Thermal Shutdown
      10. 7.3.10 Charge Pump (CP, CN)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pulse Width Modulation Operation
      2. 7.4.2 Power Save Mode Operation
      3. 7.4.3 Low-Dropout Operation (100% Duty Cycle)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input and Output Capacitor Selection
        3. 8.2.2.3 Setting the Output Voltage
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS62090-Q1UNIT
RGT (QFN)
16 PINS
RθJAJunction-to-ambient thermal resistance45.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.9°C/W
RθJBJunction-to-board thermal resistance19°C/W
ψJTJunction-to-top characterization parameter1.1°C/W
ψJBJunction-to-board characterization parameter19°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.