SLVSDZ7A September   2017  – December 2017 TPS62097-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      1.8-V Output, Typical Application
      2.      1.8-V Output, Efficiency, MODE = Open
  4. 4 Revision History
  5. 5 Terminal Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 100% Duty Cycle Mode
      2. 7.3.2 Switch Current Limit and Hiccup Short Circuit Protection
      3. 7.3.3 Under Voltage Lockout (UVLO)
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Function Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Power Save Mode and Forced PWM Mode (MODE)
      3. 7.4.3 Soft Startup (SS/TR)
      4. 7.4.4 Voltage Tracking (SS/TR)
      5. 7.4.5 Power Good (PG)
  8. 8 Application Information
    1. 8.1 Application Information
    2. 8.2 1.8-V Output Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Output Filter Design
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Capacitor Selection
      3. 8.2.3 Application Performance Curves
  9. 9 Power Supply Recommendations
  10. 10PCB Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Information
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS62097-Q1WRGT UNITS
RθJA Junction-to-ambient thermal resistance 44.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 51.7 °C/W
RθJB Junction-to-board thermal resistance 19.3 °C/W
ψJT Junction-to-top characterization parameter 1.1 °C/W
ψJB Junction-to-board characterization parameter 19.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.6 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953