SLVSDZ7A September   2017  – December 2017 TPS62097-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      1.8-V Output, Typical Application
      2.      1.8-V Output, Efficiency, MODE = Open
  4. 4 Revision History
  5. 5 Terminal Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 100% Duty Cycle Mode
      2. 7.3.2 Switch Current Limit and Hiccup Short Circuit Protection
      3. 7.3.3 Under Voltage Lockout (UVLO)
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Function Modes
      1. 7.4.1 Enable and Disable (EN)
      2. 7.4.2 Power Save Mode and Forced PWM Mode (MODE)
      3. 7.4.3 Soft Startup (SS/TR)
      4. 7.4.4 Voltage Tracking (SS/TR)
      5. 7.4.5 Power Good (PG)
  8. 8 Application Information
    1. 8.1 Application Information
    2. 8.2 1.8-V Output Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Output Filter Design
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Capacitor Selection
      3. 8.2.3 Application Performance Curves
  9. 9 Power Supply Recommendations
  10. 10PCB Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Information
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.3 Thermal Information

Implementation of integrated circuits in low-profile and fine pitch surface mount packages typically requires special attention to power dissipation. Many system dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component. For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics Application Notes SZZA017 and SPRA953.