SLVSC52B July   2013  – September 2015 TPS62152-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Pulse-Width Modulation (PWM) Operation
      2. 7.3.2  100% Duty-Cycle Operation
      3. 7.3.3  Enable / Shutdown (EN)
      4. 7.3.4  Soft Start or Tracking (SS/TR)
      5. 7.3.5  Current-Limit and Short-Circuit Protection
      6. 7.3.6  Power Good (PG)
      7. 7.3.7  Pin-Selectable Output Voltage (DEF)
      8. 7.3.8  Frequency Selection (FSW)
      9. 7.3.9  Undervoltage Lockout (UVLO)
      10. 7.3.10 Thermal Shutdown
      11. 7.3.11 Tracking Function
      12. 7.3.12 Feedback Pin (FB)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode Operation
      2. 7.4.2 Active Output Discharge
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Output Capacitor
            1. 8.2.2.1.2.1 Input Capacitor
            2. 8.2.2.1.2.2 Soft-Start Capacitor
        2. 8.2.2.2 Output Filter and Loop Stability
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resource
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGT|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Development Support

For the EVM Gerber data, see SLVC394.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

  • Optimizing the TPS62130/40/50/60/70 Output Filter, SLVA463
  • Optimizing Transient Response of Internally Compensated dc-dc Converters With Feedforward Capacitor, SLVA289
  • Semiconductor and IC Package Thermal Metrics, SPRA953
  • Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs, SZZA017
  • TPS62130/40/50 Sequencing and Tracking, SLVA470
  • TPS62130EVM-505, TPS62140EVM-505, and TPS62150EVM-505 Evaluation Modules, SLVU437
  • Using a Feedforward Capacitor to Improve Stability and Bandwidth of TPS62130/40/50/60/70, SLVA466
  • Voltage Margining Using the TPS62130, SLVA489

11.3 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

DCS-Control is a trademark of TI.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.