SLVSC52B July 2013 – September 2015 TPS62152-Q1
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are:
For more details on how to use the thermal parameters, see Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs, SZZA017, and Semiconductor and IC Package Thermal Metrics, SPRA953.
The design of the TPS62152-Q1 device is for a maximum operating junction temperature (TJ) of 125°C. Therefore, the power losses that can be dissipated over the actual thermal resistance impose a limit on the maximum output power, given the package and the surrounding PCB structures. If the thermal resistance of the package is given, the increasing the size of the surrounding copper area and making a proper thermal connection of the IC can reduce the thermal resistance. A recommendation for getting improved thermal behavior is to use top layer metal to connect the device with wide and thick metal lines. Internal ground layers can connect to vias directly under the IC for improved thermal performance.
If short circuit or overload conditions are present, the device is protected by limiting internal power dissipation.