SLUSDN9B November   2021  – July 2022 TPS62441-Q1 , TPS62442-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Schematic
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Precise Enable (EN)
      2. 9.3.2 COMP/FSET
      3. 9.3.3 MODE/SYNC
      4. 9.3.4 Spread Spectrum Clocking (SSC)
      5. 9.3.5 Undervoltage Lockout (UVLO)
      6. 9.3.6 Power-Good Output (PG)
      7. 9.3.7 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Pulse Width Modulation (PWM) Operation
      2. 9.4.2 Power Save Mode Operation (PWM and PFM)
      3. 9.4.3 100% Duty-Cycle Operation
      4. 9.4.4 Current Limit and Short Circuit Protection
      5. 9.4.5 Foldback Current Limit and Short Circuit Protection
      6. 9.4.6 Output Discharge
      7. 9.4.7 Soft Start
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Programming the Output Voltage
      2. 10.1.2 External Component Selection
        1. 10.1.2.1 Inductor Selection
        2. 10.1.2.2 Capacitor Selection
          1. 10.1.2.2.1 Input Capacitor
          2. 10.1.2.2.2 Output Capacitor
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12.1 Layout Guidelines

A proper layout is critical for the operation of a switched mode power supply, even more at high switching frequencies. Therefore, the PCB layout of the TPS6244x-Q1 demands careful attention to ensure operation and to get the performance specified. A poor layout can lead to issues like the following:

  • Poor regulation (both line and load)
  • Stability and accuracy weaknesses
  • Increased EMI radiation
  • Noise sensitivity

See Figure 12-1 for the recommended layout of the TPS6244x-Q1, which is designed for common external ground connections. The input capacitor should be placed as close as possible between the VIN and GND pin.

Provide low inductive and resistive paths for loops with high di/dt. Therefore, paths conducting the switched load current must be as short and wide as possible. Provide low capacitive paths (with respect to all other nodes) for wires with high dv/dt. Therefore, the input and output capacitance should be placed as close as possible to the IC pins and parallel wiring over long distances as well as narrow traces should be avoided. Loops that conduct an alternating current must outline an area as small as possible, as this area is proportional to the energy radiated.

Sensitive nodes like FB need to be connected with short wires and not nearby high dv/dt signals (for example, SW). As they carry information about the output voltage, nodes must be connected as close as possible to the actual output voltage (at the output capacitor). The FB resistors, R1 and R2, as well as R3 and R4 must be kept close to the IC and connect directly to those pins and the system ground plane.

The package uses the pins for power dissipation. Thermal vias on the VIN, GND, and SW pins help to spread the heat into the PCB.

The recommended layout is implemented on the EVM and shown in the TPS62442EVM-122 User's Guide.