SLVS952G April   2010  – January 2017 TPS62671 , TPS62672 , TPS62674 , TPS62675 , TPS626751 , TPS626765 , TPS62679

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 Handling Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Switching Frequency
      2. 10.3.2 Power Save Mode
      3. 10.3.3 Mode Selection
      4. 10.3.4 Spread Spectrum, PWM Frequency Dithering
      5. 10.3.5 Short-Circuit Protection
      6. 10.3.6 Thermal Shutdown
    4. 10.4 Device Functional Modes
      1. 10.4.1 Soft Start
      2. 10.4.2 Enable
      3. 10.4.3 Active Output Discharge
      4. 10.4.4 Undervoltage Lockout
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Applications
      1. 11.2.1 TPS6267x Point-Of-Load Supply
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
          1. 11.2.1.2.1 Inductor Selection
          2. 11.2.1.2.2 Output Capacitor Selection
          3. 11.2.1.2.3 Input Capacitor Selection
          4. 11.2.1.2.4 Checking Loop Stability
        3. 11.2.1.3 Application Curves
      2. 11.2.2 1.26V CMOS Sensor Embedded Power Solution — Featuring Sub 0.4mm Profile
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
        3. 11.2.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
    2. 14.2 Documentation Support
      1. 14.2.1 Related Documentation
        1. 14.2.1.1 References
    3. 14.3 Related Links
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Device and Documentation Support

14.1 Device Support

14.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

14.2 Documentation Support

14.2.1 Related Documentation

14.2.1.1 References

"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.

14.3 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 2. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS62671 Click here Click here Click here Click here Click here
TPS62672 Click here Click here Click here Click here Click here
TPS62674 Click here Click here Click here Click here Click here
TPS62675 Click here Click here Click here Click here Click here
TPS626751 Click here Click here Click here Click here Click here
TPS626765 Click here Click here Click here Click here Click here
TPS62679 Click here Click here Click here Click here Click here

14.4 Trademarks

NanoFree is a trademark of Texas Instruments.

Bluetooth is a trademark of Bluetooth SIG, Inc.

14.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

14.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.