SLVSGU9 October   2024 TPS62810-EP , TPS62811-EP , TPS62812-EP , TPS62813-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Schematic
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Precise Enable
      2. 8.3.2 COMP/FSET
      3. 8.3.3 MODE/SYNC
      4. 8.3.4 Spread Spectrum Clocking (SSC)
      5. 8.3.5 Undervoltage Lockout (UVLO)
      6. 8.3.6 Power-Good Output (PG)
      7. 8.3.7 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (PWM/PFM)
      3. 8.4.3 100% Duty-Cycle Operation
      4. 8.4.4 Current Limit and Short-Circuit Protection
      5. 8.4.5 Foldback Current Limit and Short-Circuit Protection
      6. 8.4.6 Output Discharge
      7. 8.4.7 Soft Start/Tracking (SS/TR)
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Programming the Output Voltage
      2. 9.1.2 Inductor Selection
      3. 9.1.3 Capacitor Selection
        1. 9.1.3.1 Input Capacitor
        2. 9.1.3.2 Output Capacitor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Voltage Tracking
      2. 9.3.2 Synchronizing to an External Clock
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.7 Thermal Shutdown

The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds 170°C (typ), the device goes into thermal shutdown. Both the high-side and low-side power FETs are turned off and PG goes low. When TJ decreases by the hysteresis amount of typically 15°C, the device resumes normal operation, beginning with soft start. During a PFM pause, the thermal shutdown is not active. After a PFM pause, the device needs up to 9 µs to detect a too-high junction temperature. If the PFM burst is shorter than this delay, the device does not detect a too-high junction temperature.