SLVSEC6D June   2019  – March 2020 TPS62840

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Efficiency versus Load Current (VOUT = 1.8 V)
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Smart Enable and Shutdown
      2. 8.3.2 Soft Start
      3. 8.3.3 Mode Selection: Power-Save Mode (PFM/PWM) or Forced PWM Operation (FPWM)
      4. 8.3.4 Output Voltage Selection (VSET)
      5. 8.3.5 Undervoltage Lockout UVLO
      6. 8.3.6 Switch Current Limit / Short Circuit Protection
      7. 8.3.7 Output Voltage Discharge
      8. 8.3.8 Thermal Shutdown
      9. 8.3.9 STOP Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Save Mode Operation
      2. 8.4.2 Forced PWM Mode Operation
      3. 8.4.3 100% Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Example
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) 8 Pins DLC Package 6 Pins YBG Package 8 Pins DGR Package DGR EVM UNIT
JEDEC PCB 51-7 JEDEC PCB 51-5 TPS62841-2EVM123
RθJA Junction-to-ambient thermal resistance 105.6 133.4 54.4 46.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75.7 0.4 58.1 N/A °C/W
RθJB Junction-to-board thermal resistance 31.9 39.4 25.9 N/A °C/W
ψJT Junction-to-top characterization parameter 2.3 0.1 1.2 0.9 °C/W
ψJB Junction-to-board characterization parameter 31.5 39.4 25.9 17.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a 11.7 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.