SLVSEC6D June   2019  – March 2020 TPS62840

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Efficiency versus Load Current (VOUT = 1.8 V)
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Smart Enable and Shutdown
      2. 8.3.2 Soft Start
      3. 8.3.3 Mode Selection: Power-Save Mode (PFM/PWM) or Forced PWM Operation (FPWM)
      4. 8.3.4 Output Voltage Selection (VSET)
      5. 8.3.5 Undervoltage Lockout UVLO
      6. 8.3.6 Switch Current Limit / Short Circuit Protection
      7. 8.3.7 Output Voltage Discharge
      8. 8.3.8 Thermal Shutdown
      9. 8.3.9 STOP Mode
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Save Mode Operation
      2. 8.4.2 Forced PWM Mode Operation
      3. 8.4.3 100% Mode Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 System Example
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.8 Thermal Shutdown

The junction temperature (TJ) of the device is monitored by an internal temperature sensor. The device enters thermal shutdown when the junction temperature exceeds the thermal shutdown threshold (TSD) of 160°C (typ.). Both the high-side and low-side MOSFETs are turned off. The device resumes its operation when the junction temperature falls below typically 155°C again and begins with a soft-start cycle without reading RSET again. In Power-Save Mode, the thermal shutdown feature is disabled.