SLVSG71 june   2023 TPS62901-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Mode Selection and Device Configuration MODE/S-CONF
      2. 8.3.2  Adjustable VO Operation (External Voltage Divider)
      3. 8.3.3  Selectable VO Operation (VSET and Internal Voltage Divider)
      4. 8.3.4  Soft Start and Tracking (SS/TR)
        1. 8.3.4.1 Tracking Function
      5. 8.3.5  Smart Enable with Precise Threshold
      6. 8.3.6  Power Good (PG)
      7. 8.3.7  Output Discharge Function
      8. 8.3.8  Undervoltage Lockout (UVLO)
      9. 8.3.9  Current Limit and Short-Circuit Protection
      10. 8.3.10 High Temperature Specifications
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Forced Pulse Width Modulation (FPWM) Operation
      2. 8.4.2 Power Save Mode Operation (Auto PFM and PWM)
      3. 8.4.3 AEE (Automatic Efficiency Enhancement)
      4. 8.4.4 100% Duty-Cycle Operation
      5. 8.4.5 Starting into a Prebiased Load
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application with Adjustable Output Voltage
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Programming the Output Voltage
        3. 9.2.2.3 External Component Selection
          1. 9.2.2.3.1 Output Filter and Loop Stability
          2. 9.2.2.3.2 Inductor Selection
          3. 9.2.2.3.3 Capacitor Selection
            1. 9.2.2.3.3.1 Output Capacitor
            2. 9.2.2.3.3.2 Input Capacitor
            3. 9.2.2.3.3.3 Soft-Start Capacitor
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Application Curves Vout = 1.8 V
        2. 9.2.3.2 Application Curves Vout = 1.2 V
        3. 9.2.3.3 Application Curves Vout = 0.6 V
    3. 9.3 Typical Application with Selectable VOUT using VSET
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Programming the Output Voltage
      3. 9.3.3 Application Curves
        1. 9.3.3.1 Application Curves Vout = 5 V
        2. 9.3.3.2 Application Curves Vout = 3.3 V
    4. 9.4 System Examples
      1. 9.4.1 LED Power Supply
      2. 9.4.2 Powering Multiple Loads
      3. 9.4.3 Voltage Tracking
      4. 9.4.4 Inverting Buck-Boost (IBB)
    5. 9.5 Power Supply Recommendations
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
      3. 9.6.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.10 High Temperature Specifications

The TPS62901-Q1 is capable of high operating junction temperatures up to 165°C. The AEC-Q100 Grade-1 maximum ambient temperature requirement (TA_max = 125°C) combined with power dissipation on integrated chips often results in device operating temperatures well above 125 °C. Additionally, although Grade 1 with extended temperature does not exist as a standard by itself, the 165°C maximum operating junction temperature allows for the TPS62901-Q1 to be used in applications with ambient temperatures upwards of 150°C that require less device power dissipation.

Note:

For more information on the different thermal metrics for semiconductor integrated circuits (ICs) including the relationship between the operating junction (TJ) and ambient (TA) temperatures of a device, refer to the Semiconductor and IC Package Thermal Metrics application report.

The TPS62901-Q1 is designed to sustain these high temperatures while maintaining performance and reliability, which is accomplished by compliant electrical specifications up to TJ = 165°C. In addition, extra reliability testing has been performed that exceeds the AEC-Q100 Grade 1 requirements.