SLVSG71 june   2023 TPS62901-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Mode Selection and Device Configuration MODE/S-CONF
      2. 8.3.2  Adjustable VO Operation (External Voltage Divider)
      3. 8.3.3  Selectable VO Operation (VSET and Internal Voltage Divider)
      4. 8.3.4  Soft Start and Tracking (SS/TR)
        1. 8.3.4.1 Tracking Function
      5. 8.3.5  Smart Enable with Precise Threshold
      6. 8.3.6  Power Good (PG)
      7. 8.3.7  Output Discharge Function
      8. 8.3.8  Undervoltage Lockout (UVLO)
      9. 8.3.9  Current Limit and Short-Circuit Protection
      10. 8.3.10 High Temperature Specifications
      11. 8.3.11 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Forced Pulse Width Modulation (FPWM) Operation
      2. 8.4.2 Power Save Mode Operation (Auto PFM and PWM)
      3. 8.4.3 AEE (Automatic Efficiency Enhancement)
      4. 8.4.4 100% Duty-Cycle Operation
      5. 8.4.5 Starting into a Prebiased Load
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application with Adjustable Output Voltage
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Programming the Output Voltage
        3. 9.2.2.3 External Component Selection
          1. 9.2.2.3.1 Output Filter and Loop Stability
          2. 9.2.2.3.2 Inductor Selection
          3. 9.2.2.3.3 Capacitor Selection
            1. 9.2.2.3.3.1 Output Capacitor
            2. 9.2.2.3.3.2 Input Capacitor
            3. 9.2.2.3.3.3 Soft-Start Capacitor
      3. 9.2.3 Application Curves
        1. 9.2.3.1 Application Curves Vout = 1.8 V
        2. 9.2.3.2 Application Curves Vout = 1.2 V
        3. 9.2.3.3 Application Curves Vout = 0.6 V
    3. 9.3 Typical Application with Selectable VOUT using VSET
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Programming the Output Voltage
      3. 9.3.3 Application Curves
        1. 9.3.3.1 Application Curves Vout = 5 V
        2. 9.3.3.2 Application Curves Vout = 3.3 V
    4. 9.4 System Examples
      1. 9.4.1 LED Power Supply
      2. 9.4.2 Powering Multiple Loads
      3. 9.4.3 Voltage Tracking
      4. 9.4.4 Inverting Buck-Boost (IBB)
    5. 9.5 Power Supply Recommendations
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
      3. 9.6.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.6.1 Layout Guidelines

A proper layout is critical for the operation of a switched mode power supply, even more at high switching frequencies. Therefore, the PCB layout of the TPS62901-Q1 demands careful attention to make sure the device works correctly and to get the performance specified. A poor layout can lead to issues like poor regulation (both line and load), stability and accuracy weaknesses, increased EMI radiation, and noise sensitivity.

See Figure 9-69 for the recommended layout of the TPS62901-Q1, which is designed for common external ground connections. The input capacitor must be placed as close as possible between the VIN and GND pin of TPS62901-Q1. Also, connect the VOS pin in the shortest way to VOUT at the output capacitor.

Provide low inductive and resistive paths for loops with high di/dt. Therefore paths, conducting the switched load current must be as short and wide as possible. Provide low capacitive paths (with respect to all other nodes) for traces with high dv/dt. Therefore, the input and output capacitance must be placed as close as possible to the IC pins and parallel wiring over long distances as well as narrow traces must be avoided. Loops that conduct an alternating current must outline an area as small as possible, as this area is proportional to the energy radiated.

Sensitive nodes like FB and VOS need to be connected with short wires and not nearby high dv/dt signals (for example, SW). As they carry information about the output voltage, they must be connected as close as possible to the actual output voltage (at the output capacitor). The capacitor on the SS/TR pin as well as the FB resistors, R1 and R2, must be kept close to the IC and connected directly to those pins and the system ground plane. The same applies to the VSET resistor if VSET is used to scale the output voltage.

The package uses the pins for power dissipation. Thermal vias on the VIN and GND pins help to spread the heat through the PCB.

In case any of the digital inputs EN and MODE/S-CONF must be tied to the input supply voltage at VIN, the connection must be made directly at the input capacitor as indicated in the schematics.

The recommended layout is implemented on the EVM and shown in the TPS6290x-Q1 Step-Down Converter Evaluation Module user's guide.