SLVSG65A May 2022 – March 2023 TPS62903-Q1
PRODUCTION DATA
THERMAL METRIC(1) | UNIT | |||
---|---|---|---|---|
VQFN (RYT) | ||||
JEDEC PCB | TPS6290xEVM-xxx | |||
RθJA | Junction-to-ambient thermal resistance | 97.2 | 73.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 74.4 | N/A | °C/W |
RθJB | Junction-to-board thermal resistance | 25 | N/A | °C/W |
ΨJT | Junction-to-top characterization parameter | 2.7 | 4.3 | °C/W |
ΨJB | Junction-to-board characterization parameter | 24.7 | 28 | °C/W |