SLVSFW3 March   2022 TPS629203-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Mode Selection and Device Configuration (MODE/S-CONF Pin)
      2. 8.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 8.3.3 Selectable VO Operation (VSET and Internal Voltage Divider)
      4. 8.3.4 Smart Enable with Precise Threshold
      5. 8.3.5 Power Good (PG)
      6. 8.3.6 Output Discharge Function
      7. 8.3.7 Undervoltage Lockout (UVLO)
      8. 8.3.8 Current Limit and Short Circuit Protection
      9. 8.3.9 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Forced Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (Auto PFM/PWM)
      3. 8.4.3 AEE (Automatic Efficiency Enhancement)
      4. 8.4.4 100% Duty-Cycle Operation
      5. 8.4.5 Starting into a Prebiased Load
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Programming the Output Voltage
        3. 9.2.2.3 External Component Selection
          1. 9.2.2.3.1 Output Filter and Loop Stability
          2. 9.2.2.3.2 Inductor Selection
          3. 9.2.2.3.3 Capacitor Selection
            1. 9.2.2.3.3.1 Output Capacitor
            2. 9.2.2.3.3.2 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Powering Multiple Loads
      2. 9.3.2 Inverting Buck-Boost (IBB)
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
      1. 11.2.1 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.