SLVSFS6C May   2021  – March 2023 TPS629210-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Thermal Information - DYC Package
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Mode Selection and Device Configuration (MODE/S-CONF Pin)
      2. 8.3.2 Adjustable VO Operation (External Voltage Divider)
      3. 8.3.3 Selectable VO Operation (VSET and Internal Voltage Divider)
      4. 8.3.4 Smart Enable with Precise Threshold
      5. 8.3.5 Power Good (PG)
      6. 8.3.6 Output Discharge Function
      7. 8.3.7 Undervoltage Lockout (UVLO)
      8. 8.3.8 Current Limit and Short Circuit Protection
      9. 8.3.9 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Forced Pulse Width Modulation (PWM) Operation
      2. 8.4.2 Power Save Mode Operation (Auto PFM/PWM)
      3. 8.4.3 AEE (Automatic Efficiency Enhancement)
      4. 8.4.4 100% Duty-Cycle Operation
      5. 8.4.5 Starting into a Prebiased Load
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Programming the Output Voltage
        3. 9.2.2.3 External Component Selection
          1. 9.2.2.3.1 Output Filter and Loop Stability
          2. 9.2.2.3.2 Inductor Selection
          3. 9.2.2.3.3 Capacitor Selection
            1. 9.2.2.3.3.1 Output Capacitor
            2. 9.2.2.3.3.2 Input Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Powering Multiple Loads
      2. 9.3.2 Inverting Buck-Boost (IBB)
    4. 9.4 Power Supply Recommendations
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
        1. 10.1.2.1 Custom Design With WEBENCH® Tools
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information
9.2.2.3.3.2 Input Capacitor

For most applications, 4.7-µF nominal is sufficient and is recommended, though a larger value reduces input current ripple further. The input capacitor buffers the input voltage for transient events and also decouples the converter from the supply. A low-ESR multilayer ceramic capacitor (MLCC) is recommended for best filtering and must be placed as close as possible to the VIN and GND pins.

Table 9-5 List of Capacitors
Type Nominal Capacitance [µF] Voltage Rating [V] Size Manufacturer
CGA5L1X7R1E475K160AC 4.7 25 1206#GUID-A22EFAE9-2500-45BA-9D3A-062304D0675D/INDNOTE1 TDK
CGA5L1X7R1E106K160AC 10 25 1206#GUID-A22EFAE9-2500-45BA-9D3A-062304D0675D/INDNOTE1 TDK
(1) Smaller (0805 or 0603) options may be used and are available from various manufacturers.