SLVSC58B June   2016  – March 2019 TPS63070

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current; Vo = 5 V
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram TPS63070
    3. 8.3 Functional Block Diagram TPS630701
    4. 8.4 Feature Description
      1. 8.4.1  Control Loop Description
      2. 8.4.2  Precise Enable
      3. 8.4.3  Power Good
      4. 8.4.4  Soft Start
      5. 8.4.5  PS/SYNC
      6. 8.4.6  Short Circuit Protection
      7. 8.4.7  VSEL and FB2 pins
      8. 8.4.8  Overvoltage Protection
      9. 8.4.9  Undervoltage Lockout
      10. 8.4.10 Overtemperature Protection
    5. 8.5 Device Functional Modes
      1. 8.5.1 Power Save Mode
      2. 8.5.2 Current Limit
      3. 8.5.3 Output Discharge Function (TPS630702 only)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application for adjustable version
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming The Output Voltage
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Capacitor Selection
          1. 9.2.2.3.1 Input Capacitor
          2. 9.2.2.3.2 Output Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application for Fixed Voltage Version
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Thermal Information
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS63070x UNIT
VQFN
13 PINS
RθJA Junction-to-ambient thermal resistance 63 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42 °C/W
RθJB Junction-to-board thermal resistance 13 °C/W
ψJT Junction-to-top characterization parameter 2.4 °C/W
ψJB Junction-to-board characterization parameter 13 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.