SLVSC58B June   2016  – March 2019 TPS63070

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Output Current; Vo = 5 V
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram TPS63070
    3. 8.3 Functional Block Diagram TPS630701
    4. 8.4 Feature Description
      1. 8.4.1  Control Loop Description
      2. 8.4.2  Precise Enable
      3. 8.4.3  Power Good
      4. 8.4.4  Soft Start
      5. 8.4.5  PS/SYNC
      6. 8.4.6  Short Circuit Protection
      7. 8.4.7  VSEL and FB2 pins
      8. 8.4.8  Overvoltage Protection
      9. 8.4.9  Undervoltage Lockout
      10. 8.4.10 Overtemperature Protection
    5. 8.5 Device Functional Modes
      1. 8.5.1 Power Save Mode
      2. 8.5.2 Current Limit
      3. 8.5.3 Output Discharge Function (TPS630702 only)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application for adjustable version
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming The Output Voltage
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Capacitor Selection
          1. 9.2.2.3.1 Input Capacitor
          2. 9.2.2.3.2 Output Capacitor
      3. 9.2.3 Application Curves
    3. 9.3 Typical Application for Fixed Voltage Version
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Thermal Information
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance are listed below.

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™
  • Introducing airflow in the system

For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).