SLVS530D SEPTEMBER   2005  – October 2015 TPS63700

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Load Disconnect
      3. 7.3.3 Output Overvoltage Protection
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Overtemperature Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-Start
      2. 7.4.2 PWM Operation
      3. 7.4.3 Power Save Mode Operation
      4. 7.4.4 Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Output Voltage: Converter
          1. 8.2.2.1.1 Inductor Selection
        2. 8.2.2.2 Capacitor Selection
          1. 8.2.2.2.1 Input Capacitor
          2. 8.2.2.2.2 Output Capacitors
        3. 8.2.2.3 Stabilizing the Control Loop
          1. 8.2.2.3.1 Feedback Divider
          2. 8.2.2.3.2 Compensation Capacitor
      3. 8.2.3 Application Curves
    3. 8.3 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range unless otherwise noted(1)
MIN MAX UNIT
Input voltage at VIN(2) –0.3 6 V
Input voltage at IN(2) VIN V
Minimum voltage at OUT (2) –18 V
Voltage at EN, FB, COMP, PS_GND (2) –0.3 VIN + 0.3 V
Differential voltage between OUT to VIN (2) 24 V
Operating virtual junction temperature, TJ –40 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal, unless otherwise noted.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN MAX UNIT
Input voltage range, VIN 2.7 5.5 V
Operating free-air temperature, TA –40 85 °C
Operating virtual junction temperature, TJ –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS63700 UNIT
DRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 41.2 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 62.8 °C/W
RθJB Junction-to-board thermal resistance 16.6 °C/W
ψJT Junction-to-top characterization parameter 1.2 °C/W
ψJB Junction-to-board characterization parameter 16.8 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance 4.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

–40°C to 85°C, over recommended input voltage range, typical at an ambient temperature of 25°C (unless otherwise noted)
PARAMETER(1) TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
VIN Input voltage range Pin VIN, IN 2.7 5.5 V
I(Q) Quiescent
current 		VIN VIN = 3.6 V, IOUT = 0,
EN = VIN, no switching
VOUT = –5 V 		330 400 μA
IN 640 750 μA
ISD Shutdown supply current EN = GND 0.2 1.5 μA
UVLO Undervoltage lockout
threshold		 2.1 2.35 2.7 V
TSD Thermal shutdown temperature 150 °C
Thermal Shutdown hysteresis Junction temperature decreasing 5 °C
CONTROL STAGE
VEN High level input voltage 1.4 V
VEN Low level input voltage 0.4 V
IEN Input current EN = VIN or GND 0.01 0.1 μA
POWER SWITCH
ILIM Inverter switch current limit 2.7 V < VIN < 5.5 V 860 1000 1140 mA
RDS(ON) Inverter switch on-resistance VIN = 3.6 V 440 600 mΩ
VIN = 5 V 370 500
DMAX Maximum duty cycle
inverting converter		 87.5%
DMIN Minimum duty cycle
inverting converter		 12.5%
fS Oscillator frequency 1250 1380 1500 kHz
OUTPUT
VOUT Adjustable output
voltage range		 –15 –2 V
VOUT DC output accuracy PWM mode, device switching ±3%
VREF Reference voltage IREF = 10 μA 1.2 1.213 1.225 V
VOVP Output overvoltage
protection		 –19 V
VFB Negative feedback
regulation voltage		 VIN = 2.7 V to 5.5 V –0.024 0 0.024 V
IFB Negative feedback input bias current VFBN = 0.1 VREF 2 nA
(1) Parameter does not include tolerance of external resistors.

6.6 Typical Characteristics

TPS63700 tc_moi_vi_lvs530.gif Figure 1. Maximum Output Current vs Input Voltage