SLVSD44A September   2017  – July 2018 TPS63710

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application
      2.      Efficiency vs output current for VOUT = -1.8V
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. Table 1. Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Noise Reference System
      2. 7.3.2 Duty Cycle
      3. 7.3.3 Enable
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Thermal Shutdown
      6. 7.3.6 Power Good Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft-Start
      2. 7.4.2 VOUT Discharge
      3. 7.4.3 Current Limit
      4. 7.4.4 CCP Capacitor Precharge
      5. 7.4.5 PWM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Setting the Output Voltage
        3. 8.2.2.3 Inductor Selection
        4. 8.2.2.4 Capacitor Selection
          1. 8.2.2.4.1 CCP Capacitor
          2. 8.2.2.4.2 Input Capacitor
          3. 8.2.2.4.3 Output Capacitor
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Parameter Measurement Information
    3. 8.3 System Examples
      1. 8.3.1 Typical Application for Powering the Negative Rail of a Gallium Nitride (GaN) Power Amplifier
      2. 8.3.2 Typical Application for Powering the Negative Rail of an ADC or DAC
      3. 8.3.3 Typical Application for Laser Diode Bias
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Custom Design With WEBENCH® Tools
      2. 11.1.2 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS63710 UNIT
DRR (WSON)
12 PINS
RθJA Junction-to-ambient thermal resistance 44.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.7 °C/W
RθJB Junction-to-board thermal resistance 18.9 °C/W
ψJT Junction-to-top characterization parameter 0.4 °C/W
ψJB Junction-to-board characterization parameter 19.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.