SLVS501B February   2004  – September 2015 TPS65011

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Battery Charger Electrical Characteristics
    7. 6.7 Serial Interface Timing Requirements
    8. 6.8 Dissipation Ratings
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Battery Charger
        1. 7.3.1.1 Autonomous Power Source Selection
        2. 7.3.1.2 Temperature Qualification
        3. 7.3.1.3 Battery Preconditioning
        4. 7.3.1.4 Battery Charge Current
        5. 7.3.1.5 Battery Voltage Regulation
        6. 7.3.1.6 Charge Termination and Recharge
        7. 7.3.1.7 Sleep Mode
        8. 7.3.1.8 PG Output
        9. 7.3.1.9 Thermal Considerations for Setting Charge Current
      2. 7.3.2 Step-Down Converters, VMAIN and VCORE
        1. 7.3.2.1 Power Save Mode Operation
        2. 7.3.2.2 Forced PWM
        3. 7.3.2.3 Dynamic Voltage Positioning
        4. 7.3.2.4 Soft Start
        5. 7.3.2.5 100% Duty Cycle Low Dropout Operation
        6. 7.3.2.6 Active Discharge When Disabled
        7. 7.3.2.7 Power-Good Monitoring
        8. 7.3.2.8 Overtemperature Shutdown
      3. 7.3.3 Low-Dropout Voltage Regulators
        1. 7.3.3.1 Power-Good Monitoring
        2. 7.3.3.2 Enable and Sequencing
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Power-Up Sequencing
      6. 7.3.6 System Reset and Control Signals
      7. 7.3.7 Vibrator Driver
    4. 7.4 Device Functional Modes
      1. 7.4.1 TPS65011 Power States Description
        1. 7.4.1.1 State 1: No Power
        2. 7.4.1.2 State 2: ON
        3. 7.4.1.3 State 3: Low-Power Mode
        4. 7.4.1.4 State 4: Shutdown
    5. 7.5 Programming
      1. 7.5.1 LED2 Output
      2. 7.5.2 Interrupt Management
      3. 7.5.3 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1  CHGSTATUS Register (Address: 01h—Reset: 00h)
      2. 7.6.2  REGSTATUS Register (Address: 02h—Reset: 00h)
      3. 7.6.3  MASK1 Register (Address: 03h—Reset: FFh)
      4. 7.6.4  MASK2 Register (Address: 04h—Reset: FFh)
      5. 7.6.5  ACKINT1 Register (Address: 05h—Reset: 00h)
      6. 7.6.6  ACKINT2 Register (Address: 06h—Reset: 00h)
      7. 7.6.7  CHGCONFIG Register Address: 07h—Reset: 1Bh
      8. 7.6.8  LED1_ON Register (Address: 08h—Reset: 00h)
      9. 7.6.9  LED1_PER Register (Address: 09h—Reset: 00h)
      10. 7.6.10 LED2_ON Register (Address: 0Ah—Reset: 00h)
      11. 7.6.11 LED2_PER (Register Address: 0Bh—Reset: 00h)
      12. 7.6.12 VDCDC1 Register (Address: 0Ch—Reset: 32h/33h)
      13. 7.6.13 VDCDC2 Register (Address: 0Dh—Reset: 60h/70h)
      14. 7.6.14 VREGS1 Register (Address: 0Eh—Reset: 88h)
      15. 7.6.15 MASK3 Register (Address: 0Fh—Reset: 00h)
      16. 7.6.16 DEFGPIO Register Address: (10h—Reset: 00h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection for the Main and the Core Converter
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
    1. 9.1 LDO1 Output Voltage Adjustment
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.