SLVS501B February   2004  – September 2015 TPS65011

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Battery Charger Electrical Characteristics
    7. 6.7 Serial Interface Timing Requirements
    8. 6.8 Dissipation Ratings
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Battery Charger
        1. 7.3.1.1 Autonomous Power Source Selection
        2. 7.3.1.2 Temperature Qualification
        3. 7.3.1.3 Battery Preconditioning
        4. 7.3.1.4 Battery Charge Current
        5. 7.3.1.5 Battery Voltage Regulation
        6. 7.3.1.6 Charge Termination and Recharge
        7. 7.3.1.7 Sleep Mode
        8. 7.3.1.8 PG Output
        9. 7.3.1.9 Thermal Considerations for Setting Charge Current
      2. 7.3.2 Step-Down Converters, VMAIN and VCORE
        1. 7.3.2.1 Power Save Mode Operation
        2. 7.3.2.2 Forced PWM
        3. 7.3.2.3 Dynamic Voltage Positioning
        4. 7.3.2.4 Soft Start
        5. 7.3.2.5 100% Duty Cycle Low Dropout Operation
        6. 7.3.2.6 Active Discharge When Disabled
        7. 7.3.2.7 Power-Good Monitoring
        8. 7.3.2.8 Overtemperature Shutdown
      3. 7.3.3 Low-Dropout Voltage Regulators
        1. 7.3.3.1 Power-Good Monitoring
        2. 7.3.3.2 Enable and Sequencing
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Power-Up Sequencing
      6. 7.3.6 System Reset and Control Signals
      7. 7.3.7 Vibrator Driver
    4. 7.4 Device Functional Modes
      1. 7.4.1 TPS65011 Power States Description
        1. 7.4.1.1 State 1: No Power
        2. 7.4.1.2 State 2: ON
        3. 7.4.1.3 State 3: Low-Power Mode
        4. 7.4.1.4 State 4: Shutdown
    5. 7.5 Programming
      1. 7.5.1 LED2 Output
      2. 7.5.2 Interrupt Management
      3. 7.5.3 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1  CHGSTATUS Register (Address: 01h—Reset: 00h)
      2. 7.6.2  REGSTATUS Register (Address: 02h—Reset: 00h)
      3. 7.6.3  MASK1 Register (Address: 03h—Reset: FFh)
      4. 7.6.4  MASK2 Register (Address: 04h—Reset: FFh)
      5. 7.6.5  ACKINT1 Register (Address: 05h—Reset: 00h)
      6. 7.6.6  ACKINT2 Register (Address: 06h—Reset: 00h)
      7. 7.6.7  CHGCONFIG Register Address: 07h—Reset: 1Bh
      8. 7.6.8  LED1_ON Register (Address: 08h—Reset: 00h)
      9. 7.6.9  LED1_PER Register (Address: 09h—Reset: 00h)
      10. 7.6.10 LED2_ON Register (Address: 0Ah—Reset: 00h)
      11. 7.6.11 LED2_PER (Register Address: 0Bh—Reset: 00h)
      12. 7.6.12 VDCDC1 Register (Address: 0Ch—Reset: 32h/33h)
      13. 7.6.13 VDCDC2 Register (Address: 0Dh—Reset: 60h/70h)
      14. 7.6.14 VREGS1 Register (Address: 0Eh—Reset: 88h)
      15. 7.6.15 MASK3 Register (Address: 0Fh—Reset: 00h)
      16. 7.6.16 DEFGPIO Register Address: (10h—Reset: 00h)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection for the Main and the Core Converter
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
    1. 9.1 LDO1 Output Voltage Adjustment
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

The input capacitors for the DC-DC converters should be placed as close as possible to the VINMAIN, VINCORE, and VCC pins.

  • The inductor of the output filter should be placed as close as possible to the device to provide the shortest switch node possible, reducing the noise emitted into the system and increasing the efficiency.
  • Sense the feedback voltage from the output at the output capacitors to ensure the best DC accuracy. Feedback must be routed away from noisy sources such as the inductor. If possible route on the opposite side from the switch node and inductor and place a GND plane between the feedback and the noisy sources or keep-out underneath them entirely.
  • Place the output capacitors as close as possible to the inductor to reduce the feedback loop. This will ensure best regulation at the feedback point.
  • Place the device as close as possible to the most demanding or sensitive load. The output capacitors should be placed close to the input of the load. This will ensure the best AC performance possible.
  • The input and output capacitors for the LDOs should be placed close to the device for best regulation performance.
  • Use vias to connect thermal pad to ground plane.
  • TI recommends using the common ground plane for the layout of this device. The AGND can be separated from the PGND but, a large low parasitic PGND is required to connect the PGNDx pins to the CIN and external PGND connections. If the AGND and PGND planes are separated, have one connection point to reference the grounds together. Place this connection point close to the device.

10.2 Layout Example

TPS65011 EVM_layout_slvs517a.gif Figure 47. EVM Layout