SLVS670L June   2006  – May 2018 TPS65023 , TPS65023B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics: Supply Pins VCC, VINDCDC1, VINDCDC2, VINDCDC3
    7. 6.7  Electrical Characteristics: Supply Pins VBACKUP, VSYSIN, VRTC, VINLDO
    8. 6.8  Electrical Characteristics: VDCDC1 Step-Down Converter
    9. 6.9  Electrical Characteristics: VDCDC2 Step-Down Converter
    10. 6.10 Electrical Characteristics: VDCDC3 Step-Down Converter
    11. 6.11 I2C Timing Requirements for TPS65023B
    12. 6.12 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  VRTC Output and Operation With or Without Backup Battery
      2. 7.3.2  Step-Down Converters, VDCDC1, VDCDC2, and VDCDC3
      3. 7.3.3  Power Save Mode Operation
      4. 7.3.4  Low Ripple Mode
      5. 7.3.5  Soft-Start
      6. 7.3.6  100% Duty Cycle Low Dropout Operation
      7. 7.3.7  Active Discharge When Disabled
      8. 7.3.8  Power-Good Monitoring
      9. 7.3.9  Low-Dropout Voltage Regulators
      10. 7.3.10 Undervoltage Lockout
      11. 7.3.11 Power-Up Sequencing
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 System Reset + Control Signals
        1. 7.5.1.1 DEFLDO1 and DEFLDO2
        2. 7.5.1.2 Interrupt Management and the INT Pin
      2. 7.5.2 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 VERSION Register Address: 00h (Read Only)
      2. 7.6.2 PGOODZ Register Address: 01h (Read Only)
      3. 7.6.3 MASK Register Address: 02h (Read and Write), Default Value: C0h
      4. 7.6.4 REG_CTRL Register Address: 03h (Read and Write), Default Value: FFh
      5. 7.6.5 CON_CTRL Register Address: 04h (Read and Write), Default Value: B1h
      6. 7.6.6 CON_CTRL2 Register Address: 05h (Read and Write), Default Value: 40h
      7. 7.6.7 DEFCORE Register Address: 06h (Read and Write), Default Value: 14h/1Eh
      8. 7.6.8 DEFSLEW Register Address: 07h (Read and Write), Default Value: 06h
      9. 7.6.9 LDO_CTRL Register Address: 08h (Read and Write), Default Value: Set with DEFLDO1 and DEFLDO2
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Voltage Connection
      2. 8.1.2 Unused Regulators
      3. 8.1.3 Reset Condition of DCDC1
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection for the DC-DC Converters
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Output Voltage Selection
        5. 8.2.2.5 VRTC Output
        6. 8.2.2.6 LDO1 and LDO2
        7. 8.2.2.7 TRESPWRON
        8. 8.2.2.8 VCC Filter
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Requirements for Supply Voltages Below 3.0 V
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSB|40
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPS65023x UNIT
RSB (WQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 32.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.3 °C/W
RθJB Junction-to-board thermal resistance 13.6 °C/W
ψJT Junction-to-top characterization parameter 0.1 °C/W
ψJB Junction-to-board characterization parameter 5.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.