SLVS774C June   2007  – January 2016 TPS650240 , TPS650241 , TPS650242 , TPS650243 , TPS650244 , TPS650245

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Control Signals and Supply Pins
    6. 7.6  Electrical Characteristics: VDCDC1 Step-Down Converter
    7. 7.7  Electrical Characteristics: VDCDC2 Step-Down Converter
    8. 7.8  Electrical Characteristics: VDCDC3 Step-Down Converter
    9. 7.9  Electrical Characteristics: General
    10. 7.10 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Step-Down Converters, VDCDC1, VDCDC2 and VDCDC3
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Save Mode Operation
      2. 8.4.2 Soft-Start
      3. 8.4.3 100% Duty Cycle Low-Dropout Operation
      4. 8.4.4 Low-Dropout Voltage Regulators
      5. 8.4.5 Undervoltage Lockout
      6. 8.4.6 Power-Up Sequencing
      7. 8.4.7 PWRFAIL
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Output Voltage Selection
      2. 9.1.2 Voltage Change on VDCDC3
      3. 9.1.3 Vdd_alive Output
      4. 9.1.4 LDO1 and LDO2
      5. 9.1.5 VCC Filter
    2. 9.2 Typical Applications
      1. 9.2.1 Typical Configuration for the Samsung Processor S3C6400-533MHz
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Inductor Selection for the DC-DC Converters
          2. 9.2.1.2.2 Output Capacitor Selection
          3. 9.2.1.2.3 Input Capacitor Selection
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Typical Configuration for the Titan 2 Processor
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 4. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TPS650240 Click here Click here Click here Click here Click here
TPS650241 Click here Click here Click here Click here Click here
TPS650242 Click here Click here Click here Click here Click here
TPS650243 Click here Click here Click here Click here Click here
TPS650244 Click here Click here Click here Click here Click here
TPS650245 Click here Click here Click here Click here Click here

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.