SLVS843B December   2008  – May 2018 TPS650250

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Detailed Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Dissipation Ratings
    6. 6.6  Electrical Characteristics
    7. 6.7  Electrical Characteristics VDCDC1
    8. 6.8  Electrical Characteristics VDCDC2
    9. 6.9  Electrical Characteristics VDCDC3
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Step-Down Converters, VDCDC1, VDCDC2 AND VDCDC3
      2. 7.3.2 Power Save Mode Operation
      3. 7.3.3 Soft Start
      4. 7.3.4 100% Duty Cycle Low Dropout Operation
      5. 7.3.5 Low Dropout Voltage Regulators
      6. 7.3.6 Undervoltage Lockout
      7. 7.3.7 PWRFAIL
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Configuration For The Samsung Processor S3C6400-533MHz
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Inductor Selection for the DCDC Converters
        2. 8.2.3.2 Output Capacitor Selection
        3. 8.2.3.3 Input Capacitor Selection
        4. 8.2.3.4 Output Voltage Selection
        5. 8.2.3.5 Voltage Change on VDCDC3
        6. 8.2.3.6 Vdd_alive Output
        7. 8.2.3.7 LDO1 and LDO2
        8. 8.2.3.8 Vcc-Filter
      4. 8.2.4 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2 Layout Example

TPS650250 Layout.gifFigure 20. Layout Example of VDCDC1

The most important layout practice is the placement of the input capacitor. The input capacitor should be placed as close as possible to the VINDCDCx and GND pins of the converters inorder to minimize the parasitic inductance and loop.

The second most important layout practice is to minimize the feedback cross-sectional loop of the converters. Route the feedback trace along a close path of the VOUT and switch nodes.