SLVSCF4A December   2014  – July 2016 TPS650830

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified System Diagram
  2. 2 Revision History
  3. 3  Device Options
  4. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  6. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Voltage Regulator Assignment and Powergood Comparator Logic Assignment (External Voltage Regulator or Load Switch) for Skylake and Kabylake Platform
      2. 6.3.2  Generic Powergood Window Comparator with Open-Drain Output
      3. 6.3.3  Powergood Window Comparator
      4. 6.3.4  3.3-V LDO and 3V3SW Load Switch
      5. 6.3.5  5-V LDO and 5VSW Load Switch
      6. 6.3.6  RTC Selector and 3.1-V LDO
      7. 6.3.7  Power Path Comparators
      8. 6.3.8  UVLO Comparators
      9. 6.3.9  Temperature Comparator
      10. 6.3.10 Low Power Mode (LPM) / Connected Standby / Instant Go of VRs
      11. 6.3.11 Enable and Powergood of VRs
      12. 6.3.12 VR4 VDDQ and LDO1 VTT Enabling
      13. 6.3.13 Converters
        1. 6.3.13.1  Power Save Mode
        2. 6.3.13.2  Voltage Regulator Startup
        3. 6.3.13.3  Powergood, Power Fault, and Emergency Power Shutdown
        4. 6.3.13.4  Current Limit
        5. 6.3.13.5  Output Discharge Feature
        6. 6.3.13.6  Output Voltage Control
        7. 6.3.13.7  Converter Low Power Mode Operation
        8. 6.3.13.8  Controller Low Power Mode Operation
        9. 6.3.13.9  Controller Internal Ramp Comparator
        10. 6.3.13.10 Undervoltage Lockout
      14. 6.3.14 Coincell Selector
        1. 6.3.14.1 Functional Description of RTC Powerpath and LDO
    4. 6.4 Device Functional Modes
      1. 6.4.1  OFF State - No VIN and No Backup Battery
      2. 6.4.2  Startup
      3. 6.4.3  Ready State
      4. 6.4.4  S5/S4 State
      5. 6.4.5  S3 State
      6. 6.4.6  S0 State
      7. 6.4.7  Standby
      8. 6.4.8  DSx State
      9. 6.4.9  Emergency Shutdown
      10. 6.4.10 Backup Battery / G3 - No VIN
    5. 6.5 Programming
      1. 6.5.1 I2C - Interface
        1. 6.5.1.1 F/S-Mode Protocol
        2. 6.5.1.2 Diagrams of I2C Protocol
    6. 6.6 Register Map
      1. 6.6.1 Registers
        1. 6.6.1.1  VENDORID Register (address = 0x00) [reset = 00100010]
        2. 6.6.1.2  REVID Register (address = 0x01) [reset = 00000000]
        3. 6.6.1.3  IRQLVL1 Register (address = 0x02) [reset = 00000000]
        4. 6.6.1.4  PWRSRCINT Register (address = 0x04) [reset = 00000000]
        5. 6.6.1.5  PMUINT Register (address = 0x05) [reset = 00000000]
        6. 6.6.1.6  RESETIRQ1 Register (address = 0x08) [reset = 00000000]
        7. 6.6.1.7  RESETIRQ2 Register (address = 0x09) [reset = 00000000]
        8. 6.6.1.8  MPMUINT Register (address = 0x0B) [reset = 00010100]
        9. 6.6.1.9  MPWRSRCINT Register (address = 0x0C) [reset = 01111000]
        10. 6.6.1.10 RESETIRQ1MASK Register (address = 0x11) [reset = 00110000]
        11. 6.6.1.11 RESETIRQ2MASK Register (address = 0x12) [reset = 00000010]
        12. 6.6.1.12 IRQLVL1msK Register (address = 0x13) [reset = 10100101]
        13. 6.6.1.13 PBCONFIG Register (address = 0x14) [reset = 00011111]
        14. 6.6.1.14 PBSTATUS Register (address = 0x15) [reset = 00000000]
        15. 6.6.1.15 PWRSTAT1 Register (address = 0x16) [reset = 00000000]
        16. 6.6.1.16 PWRSTAT2 Register (address = 0x17) [reset = 00000000]
        17. 6.6.1.17 PGMASK1 Register (address = 0x18) [reset = 00000000]
        18. 6.6.1.18 PGMASK2 Register (address = 0x19) [reset = 00000000]
        19. 6.6.1.19 VCCIOCNT Register (address = 0x30) [reset = 00001010]
        20. 6.6.1.20 V5ADS3CNT Register (address = 0x31) [reset = 00101010]
        21. 6.6.1.21 V33ADSWCNT Register (address = 0x32) [reset = 00101010]
        22. 6.6.1.22 V33APCHCNT Register (address = 0x33) [reset = 00001010]
        23. 6.6.1.23 V18ACNT Register (address = 0x34) [reset = 00101010]
        24. 6.6.1.24 V18U25UCNT Register (address = 0x35) [reset = 00001010]
        25. 6.6.1.25 V1P2UCNT Register (address = 0x36) [reset = 00111010]
        26. 6.6.1.26 V100ACNT Register (address = 0x37) [reset = 00011010]
        27. 6.6.1.27 V085ACNT Register (address = 0x38) [reset = 00101010]
        28. 6.6.1.28 VRMODECTRL Register (address = 0x3B) [reset = 00111111]
        29. 6.6.1.29 DISCHCNT1 Register (address = 0x3C) [reset = 00000000]
        30. 6.6.1.30 DISCHCNT2 Register (address = 0x3D) [reset = 00000000]
        31. 6.6.1.31 DISCHCNT3 Register (address = 0x3E) [reset = 00000000]
        32. 6.6.1.32 DISCHCNT4 Register (address = 0x3F) [reset = 00000000]
        33. 6.6.1.33 PWRGDCNT1 Register (address = 0x40) [reset = 01011111 ]
        34. 6.6.1.34 VREN Register (address = 0x41) [reset = 00000000]
        35. 6.6.1.35 REGLOCK Register (address = 0x42) [reset = 00000000]
        36. 6.6.1.36 VRENPINMASK Register (address = 0x43) [reset = 00000000]
        37. 6.6.1.37 RSTCTRL Register (address = 0x48) [reset = 00011100]
        38. 6.6.1.38 SDWNCTRL Register (address = 0x49) [reset = 00000000]
        39. 6.6.1.39 VDLMTCRT Register (address = 0x51) [reset = 00000101]
        40. 6.6.1.40 ACOKDBDM Register (address = 0x69) [reset = 00001111]
        41. 6.6.1.41 LOWBATTDET Register (address = 0x6A) [reset = 11111000]
        42. 6.6.1.42 SPWRSRCINT Register (address = 0x6F) [reset = 00000000]
        43. 6.6.1.43 CLKCTRL1 Register (address = 0xD0) [reset = 00000000]
        44. 6.6.1.44 COMPA_REF Register (address = 0xDD) [reset = 00000000]
        45. 6.6.1.45 COMPB_REF Register (address = 0xDE) [reset = 00000000]
        46. 6.6.1.46 COMPC_REF Register (address = 0xDF) [reset = 00000000]
        47. 6.6.1.47 COMPD_REF Register (address = 0xE0) [reset = 00000000]
        48. 6.6.1.48 COMPE_REF Register (address = 0xE1) [reset = 00000000]
        49. 6.6.1.49 COMPF_REF Register (address = 0xE2) [reset = 00000000]
        50. 6.6.1.50 COMPG_REF Register (address = 0xE3) [reset = 00000000]
        51. 6.6.1.51 COMPH_REF Register (address = 0xE4) [reset = 00000000]
        52. 6.6.1.52 PWFAULT_MASK1 Register (address = 0xE5) [reset = 00000000]
        53. 6.6.1.53 PWFAULT_MASK2 Register (address = 0xE6) [reset = 00000000]
        54. 6.6.1.54 PGOOD_STAT1 Register (address = 0xE7) [reset = 00000000]
        55. 6.6.1.55 PGOOD_STAT2 Register (address = 0xE8) [reset = 00000000]
        56. 6.6.1.56 MISC_BITS Register (address = 0xE9) [reset = 00010000]
        57. 6.6.1.57 STDBY_CTRL Register (address = 0xEA) [reset = 11111110]
        58. 6.6.1.58 TEMPCRIT Register (address = 0xEB) [reset = 00000000]
        59. 6.6.1.59 TEMPHOT Register (address = 0xEC) [reset = 00000000]
        60. 6.6.1.60 VREN_PIN_OVR Register (address = 0xEE) [reset = 00000000]
  7. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Controller Design Procedure
          1. 7.2.2.1.1 Selecting the Inductor
          2. 7.2.2.1.2 Selecting the Output Capacitors
          3. 7.2.2.1.3 Selecting the FETs
          4. 7.2.2.1.4 Bootstrap Capacitor
          5. 7.2.2.1.5 Setting the Current Limits
          6. 7.2.2.1.6 Selecting the Input Capacitors
        2. 7.2.2.2 Converter Design Procedure
          1. 7.2.2.2.1 Selecting the Inductor
          2. 7.2.2.2.2 Selecting the Output Capacitors
          3. 7.2.2.2.3 Selecting the Input Capacitors
        3. 7.2.2.3 LDO Design Procedure
        4. 7.2.2.4 Board Temperature Monitoring Design Procedure
        5. 7.2.2.5 Power Path Design Procedure
      3. 7.2.3 Application Performance Curves
      4. 7.2.4 Specific Application - TPS650830 Powering the Intel SkyLake and Kabylake Platform Volume Configuration
        1. 7.2.4.1 Design Requirements
        2. 7.2.4.2 Detailed Design Procedure
          1. 7.2.4.2.1 Output Inductance and Capacitance
        3. 7.2.4.3 Application Performance Curves
    3. 7.3 System Example
    4. 7.4 Do's and Don'ts
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Fanout for ZAJ using Type 4 Routing
      2. 9.1.2 Fanout for ZCG using Type 3 Routing
      3. 9.1.3 Layout Checklist
    2. 9.2 Layout Example
      1. 9.2.1 Controller Layout
      2. 9.2.2 ZAJ Package
      3. 9.2.3 ZCG Package
    3. 9.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
      2. 10.1.2 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device and Documentation Support

10.1 Device Support

For device support, please submit questions to the E2E forum here:e2e.ti.com

10.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

10.1.2 Development Support

For frequently asked questions, FAQs, on the TPS65083x, please refer to the FAQ here: http://e2e.ti.com/support/power_management/pmu/w/design_notes/2898.tps65083x-faqs

10.2 Documentation Support

10.2.1 Related Documentation

For related documentation see the following:

  • Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs Application Report SZZA017
  • Semiconductor and IC Package Thermal Metrics Application Report SPRA953

10.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates—including silicon errata—go to the product folder for your device on ti.com. In the upper right-hand corner, click the "Alert me" button. This registers you to receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

10.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support. Quickly find helpful E2E forums along with design support tools and contact information for technical support.

10.5 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

10.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

10.7 Glossary

    TI Glossary This glossary lists and explains terms, acronyms, and definitions.