SWCS133E September   2015  – October 2024 TPS65094

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
    1. 4.1 OTP Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Total Current Consumption
    6. 6.6  Electrical Characteristics: Reference and Monitoring System
    7. 6.7  Electrical Characteristics: Buck Controllers
    8. 6.8  Electrical Characteristics: Synchronous Buck Converters
    9. 6.9  Electrical Characteristics: LDOs
    10. 6.10 Electrical Characteristics: Load Switches
    11. 6.11 Digital Signals: I2C Interface
    12. 6.12 Digital Input Signals (LDOLS_EN, SWA1_EN, THERMTRIPB, PMICEN, SLP_S3B, SLP_S4B, SLP_S0B)
    13. 6.13 Digital Output Signals (IRQB, RSMRSTB, PCH_PWROK, PROCHOT)
    14. 6.14 Timing Requirements
    15. 6.15 Switching Characteristics
    16. 6.16 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Good (PGOOD)
      2. 7.3.2 Register Reset Conditions
      3. 7.3.3 SMPS Voltage Regulators
        1. 7.3.3.1 Controller Overview
        2. 7.3.3.2 Converter Overview
        3. 7.3.3.3 DVS
        4. 7.3.3.4 Current Limit
      4. 7.3.4 LDOs and Load Switches
        1. 7.3.4.1 VTT LDO
        2. 7.3.4.2 LDOA1–LDOA3
        3. 7.3.4.3 Load Switches
      5. 7.3.5 Power Sequencing and VR Control
        1. 7.3.5.1 Cold Boot
        2. 7.3.5.2 Cold OFF
        3. 7.3.5.3 Connected Standby Entry and Exit
        4. 7.3.5.4 S0 to S3 Entry and Exit
        5. 7.3.5.5 S0 to S4/5 Entry and Exit
        6. 7.3.5.6 Emergency Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Off Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 F/S-Mode Protocol
    6. 7.6 Register Maps
      1. 7.6.1  55
      2. 7.6.2  VENDORID: PMIC Vendor ID Register (offset = 00h) [reset = 0010 0010]
      3. 7.6.3  DEVICEID: PMIC Device and Revision ID Register (offset = 01h) [reset = OTP Dependent]
      4. 7.6.4  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
      5. 7.6.5  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
      6. 7.6.6  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
      7. 7.6.7  OFFONSRC: PMIC Power Transition Event Register (offset = 05h) [reset = 0000 0000]
      8. 7.6.8  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = 0011 1000]
      9. 7.6.9  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = 0000 0000]
      10. 7.6.10 BUCK3CTRL: BUCK3 Control Register (offset = 23h) [reset = 0001 0001]
      11. 7.6.11 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = OTP Dependent]
      12. 7.6.12 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = OTP Dependent]
      13. 7.6.13 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = 0011 1101]
      14. 7.6.14 DISCHCNT1: Discharge Control1 Register (offset = 40h) [reset = 0101 0101]
      15. 7.6.15 DISCHCNT2: Discharge Control2 Register (offset = 41h) [reset = 0101 0101]
      16. 7.6.16 DISCHCNT3: Discharge Control3 Register (offset = 42h) [reset = 0000 0101]
      17. 7.6.17 POK_DELAY: PCH_PWROK Delay Register (offset = 43h) [reset = 0000 0111]
      18. 7.6.18 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
      19. 7.6.19 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = 0010 1111]
      20. 7.6.20 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = 0100 1011]
      21. 7.6.21 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = OTP Dependent]
      22. 7.6.22 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = OTP Dependent]
      23. 7.6.23 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = OTP Dependent]
      24. 7.6.24 VR_CTRL1: BUCK1-3 Control Register (offset = 9Ch) [reset = OTP Dependent]
      25. 7.6.25 VR_CTRL2: VR Enable Register (offset = 9Eh) [reset = 0000 0000]
      26. 7.6.26 VR_CTRL3: VR Enable/Disable Register (offset = 9Fh) [reset = OTP Dependent]
      27. 7.6.27 GPO_CTRL: GPO Control Register (offset = A1h) [reset = 0010 0000]
      28. 7.6.28 PWR_FAULT_MASK1: VR Power Fault Mask1 Register (offset = A2h) [reset = 1100 0000]
      29. 7.6.29 PWR_FAULT_MASK2: VR Power Fault Mask2 Register (offset = A3h) [reset = 0011 0111]
      30. 7.6.30 DISCHCNT4: Discharge Control4 Register (offset = ADh) [reset = 0110 0001]
      31. 7.6.31 LDOA1CTRL: LDOA1 Control Register (offset = AEh) [reset = OTP Dependent]
      32. 7.6.32 PG_STATUS1: Power Good Status1 Register (offset = B0h) [reset = 0000 0000]
      33. 7.6.33 PG_STATUS2: Power Good Status2 Register (offset = B1h) [reset = 0000 0000]
        1. 7.6.33.1 PWR_FAULT_STATUS1: Power Fault Status1 Register (offset = B2h) [reset = 0000 0000]
        2. 7.6.33.2 PWR_FAULT_STATUS2: Power Fault Status2 Register (offset = B3h) [reset = 0000 0000]
      34. 7.6.34 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Controller Design Procedure
          1. 8.1.2.1.1 Selecting the Output Capacitors
          2. 8.1.2.1.2 Selecting the Inductor
          3. 8.1.2.1.3 Selecting the FETs
          4. 8.1.2.1.4 Bootstrap Capacitor
          5. 8.1.2.1.5 Selecting the Input Capacitors
            1. 8.1.2.1.5.1 Setting the Current Limit
        2. 8.1.2.2 Converter Design Procedure
          1. 8.1.2.2.1 Selecting the Inductor
          2. 8.1.2.2.2 Selecting the Output Capacitors
          3. 8.1.2.2.3 Selecting the Input Capacitors
        3. 8.1.2.3 LDO Design Procedure
      3. 8.1.3 Application Curves
    2. 8.2 Specific Application for TPS650944
    3. 8.3 Dos and Don'ts
    4.     Power Supply Recommendations
    5. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS65094xUNIT
RSK (VQFN)
64 PINS
RθJAJunction-to-ambient thermal resistance25.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance11.3°C/W
RθJBJunction-to-board thermal resistance4.4°C/W
ψJTJunction-to-top characterization parameter0.2°C/W
ψJBJunction-to-board characterization parameter4.4°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.7°C/W
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.