SWCS133E September   2015  – October 2024 TPS65094

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Options
    1. 4.1 OTP Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: Total Current Consumption
    6. 6.6  Electrical Characteristics: Reference and Monitoring System
    7. 6.7  Electrical Characteristics: Buck Controllers
    8. 6.8  Electrical Characteristics: Synchronous Buck Converters
    9. 6.9  Electrical Characteristics: LDOs
    10. 6.10 Electrical Characteristics: Load Switches
    11. 6.11 Digital Signals: I2C Interface
    12. 6.12 Digital Input Signals (LDOLS_EN, SWA1_EN, THERMTRIPB, PMICEN, SLP_S3B, SLP_S4B, SLP_S0B)
    13. 6.13 Digital Output Signals (IRQB, RSMRSTB, PCH_PWROK, PROCHOT)
    14. 6.14 Timing Requirements
    15. 6.15 Switching Characteristics
    16. 6.16 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Good (PGOOD)
      2. 7.3.2 Register Reset Conditions
      3. 7.3.3 SMPS Voltage Regulators
        1. 7.3.3.1 Controller Overview
        2. 7.3.3.2 Converter Overview
        3. 7.3.3.3 DVS
        4. 7.3.3.4 Current Limit
      4. 7.3.4 LDOs and Load Switches
        1. 7.3.4.1 VTT LDO
        2. 7.3.4.2 LDOA1–LDOA3
        3. 7.3.4.3 Load Switches
      5. 7.3.5 Power Sequencing and VR Control
        1. 7.3.5.1 Cold Boot
        2. 7.3.5.2 Cold OFF
        3. 7.3.5.3 Connected Standby Entry and Exit
        4. 7.3.5.4 S0 to S3 Entry and Exit
        5. 7.3.5.5 S0 to S4/5 Entry and Exit
        6. 7.3.5.6 Emergency Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Off Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Active Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 F/S-Mode Protocol
    6. 7.6 Register Maps
      1. 7.6.1  55
      2. 7.6.2  VENDORID: PMIC Vendor ID Register (offset = 00h) [reset = 0010 0010]
      3. 7.6.3  DEVICEID: PMIC Device and Revision ID Register (offset = 01h) [reset = OTP Dependent]
      4. 7.6.4  IRQ: PMIC Interrupt Register (offset = 02h) [reset = 0000 0000]
      5. 7.6.5  IRQ_MASK: PMIC Interrupt Mask Register (offset = 03h) [reset = 1111 1111]
      6. 7.6.6  PMICSTAT: PMIC Status Register (offset = 04h) [reset = 0000 0000]
      7. 7.6.7  OFFONSRC: PMIC Power Transition Event Register (offset = 05h) [reset = 0000 0000]
      8. 7.6.8  BUCK1CTRL: BUCK1 Control Register (offset = 20h) [reset = 0011 1000]
      9. 7.6.9  BUCK2CTRL: BUCK2 Control Register (offset = 21h) [reset = 0000 0000]
      10. 7.6.10 BUCK3CTRL: BUCK3 Control Register (offset = 23h) [reset = 0001 0001]
      11. 7.6.11 BUCK4CTRL: BUCK4 Control Register (offset = 25h) [reset = OTP Dependent]
      12. 7.6.12 BUCK5CTRL: BUCK5 Control Register (offset = 26h) [reset = OTP Dependent]
      13. 7.6.13 BUCK6CTRL: BUCK6 Control Register (offset = 27h) [reset = 0011 1101]
      14. 7.6.14 DISCHCNT1: Discharge Control1 Register (offset = 40h) [reset = 0101 0101]
      15. 7.6.15 DISCHCNT2: Discharge Control2 Register (offset = 41h) [reset = 0101 0101]
      16. 7.6.16 DISCHCNT3: Discharge Control3 Register (offset = 42h) [reset = 0000 0101]
      17. 7.6.17 POK_DELAY: PCH_PWROK Delay Register (offset = 43h) [reset = 0000 0111]
      18. 7.6.18 FORCESHUTDN: Force Emergency Shutdown Control Register (offset = 91h) [reset = 0000 0000]
      19. 7.6.19 BUCK4VID: BUCK4 VID Register (offset = 94h) [reset = 0010 1111]
      20. 7.6.20 BUCK5VID: BUCK5 VID Register (offset = 96h) [reset = 0100 1011]
      21. 7.6.21 BUCK6VID: BUCK6 VID Register (offset = 98h) [reset = OTP Dependent]
      22. 7.6.22 LDOA2VID: LDOA2 VID Register (offset = 9Ah) [reset = OTP Dependent]
      23. 7.6.23 LDOA3VID: LDOA3 VID Register (offset = 9Bh) [reset = OTP Dependent]
      24. 7.6.24 VR_CTRL1: BUCK1-3 Control Register (offset = 9Ch) [reset = OTP Dependent]
      25. 7.6.25 VR_CTRL2: VR Enable Register (offset = 9Eh) [reset = 0000 0000]
      26. 7.6.26 VR_CTRL3: VR Enable/Disable Register (offset = 9Fh) [reset = OTP Dependent]
      27. 7.6.27 GPO_CTRL: GPO Control Register (offset = A1h) [reset = 0010 0000]
      28. 7.6.28 PWR_FAULT_MASK1: VR Power Fault Mask1 Register (offset = A2h) [reset = 1100 0000]
      29. 7.6.29 PWR_FAULT_MASK2: VR Power Fault Mask2 Register (offset = A3h) [reset = 0011 0111]
      30. 7.6.30 DISCHCNT4: Discharge Control4 Register (offset = ADh) [reset = 0110 0001]
      31. 7.6.31 LDOA1CTRL: LDOA1 Control Register (offset = AEh) [reset = OTP Dependent]
      32. 7.6.32 PG_STATUS1: Power Good Status1 Register (offset = B0h) [reset = 0000 0000]
      33. 7.6.33 PG_STATUS2: Power Good Status2 Register (offset = B1h) [reset = 0000 0000]
        1. 7.6.33.1 PWR_FAULT_STATUS1: Power Fault Status1 Register (offset = B2h) [reset = 0000 0000]
        2. 7.6.33.2 PWR_FAULT_STATUS2: Power Fault Status2 Register (offset = B3h) [reset = 0000 0000]
      34. 7.6.34 TEMPHOT: Temperature Hot Status Register (offset = B5h) [reset = 0000 0000]
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Controller Design Procedure
          1. 8.1.2.1.1 Selecting the Output Capacitors
          2. 8.1.2.1.2 Selecting the Inductor
          3. 8.1.2.1.3 Selecting the FETs
          4. 8.1.2.1.4 Bootstrap Capacitor
          5. 8.1.2.1.5 Selecting the Input Capacitors
            1. 8.1.2.1.5.1 Setting the Current Limit
        2. 8.1.2.2 Converter Design Procedure
          1. 8.1.2.2.1 Selecting the Inductor
          2. 8.1.2.2.2 Selecting the Output Capacitors
          3. 8.1.2.2.3 Selecting the Input Capacitors
        3. 8.1.2.3 LDO Design Procedure
      3. 8.1.3 Application Curves
    2. 8.2 Specific Application for TPS650944
    3. 8.3 Dos and Don'ts
    4.     Power Supply Recommendations
    5. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.5 Power Sequencing and VR Control

When a valid power source is available at VSYS (VSYS ≥ 5.6 V), internal analog blocks including LDO5 and LDO3P3 are enabled. For part numbers with LDOA1 set as an always on rail, the PMIC leaves reset and I2C communication is available as soon as LDO3P3 and LDO5 power goods are confirmed. For part numbers with LDOA1 set as a general-purpose LDO, the PMIC remains in reset until PMICEN is set high. Five input pins of the TPS65094x device are driven by a host or by external-controller (EC) defined power states that transition from one to another in sequence.

Table 7-8 shows various system-level power states. Also, Table 7-9 summarizes a list of active rails in each power state. The sequencing for the transitions between these states is described in the following sections.

If a rail is either disabled by I2C or OTP programming, then it is not enabled by the following sequences. For example, VTT LDO is not enabled for LPDDR4 OTPs.

Table 7-8 Power State and Corresponding I/O Status
POWER STATE SIGNALS TO PMIC SIGNALS FROM PMIC
PMICEN SLP_S4B(1) SLP_S3B(1) SLP_S0B(2) THERMTRIPB(3) RSMRSTB PCH_PWROK
G3 0 0 0 0 0 0 0
S4/S5 1 0 0 1 1 1 0
S3 1 1 0 1 1 1 0
S0iX 1 1 1 0 1 1 1
S0 1 1 1 1 1 1 1
(1) When PMIC is first enabled, SLP_S4B and SLP_S3B are to be treated as if they are low (actual state of signal ignored) until the deassertion of RSMRSTB (L → H).
(2) When PMIC is first enabled, SLP_S0B are to be treated as if they are high (actual state of signal ignored) until the assertion of PCH_PWROK (L → H).
(3) THERMTRIPB is to be treated as if it is high (actual state of signal ignored) until the deassertion of RSMRSTB (L → H).
Table 7-9 Active Rails in Each Power State
POWER STATE ACTIVE RAILS
S4/S5 BUCK1 (VNN), BUCK4 (V1P8A), BUCK5 (V1P24A)
S3 Rails in S4/S5 + SWB1_2 (V1P8U)(1), BUCK6 (VDDQ)
S0 Rails in S3 + SWB1_2(2), VTT, BUCK2 (VCCGI), BUCK3 (VCCRAM)
S0iX Rails in S0 – BUCK1 (VNN), BUCK2 (VCCGI), BUCK3 (VCCRAM), VTT
(1) For LPDDR3 and LPDDR4
(2) For DDR3L