SLVS849C July   2008  – September 2017 TPS65100-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Main Boost Converter
      2. 7.3.2 VCOM Buffer
      3. 7.3.3 Positive Charge Pump
      4. 7.3.4 Negative Charge Pump
      5. 7.3.5 Linear Regulator Controller
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Power-ON Sequencing (EN, ENR)
      2. 7.4.2 Soft Start
      3. 7.4.3 Fault Protection
      4. 7.4.4 Thermal Shutdown
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Supply for a Typical Approximately 7-inch Display
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Boost Converter Design Procedure
            1. 8.2.1.2.1.1 Inductor Selection
            2. 8.2.1.2.1.2 Output Capacitor Selection
            3. 8.2.1.2.1.3 Input Capacitor Selection
            4. 8.2.1.2.1.4 Rectifier Diode Selection
            5. 8.2.1.2.1.5 Converter Loop Design and Stability
            6. 8.2.1.2.1.6 Design Procedure Quick Steps
            7. 8.2.1.2.1.7 Setting the Output Voltage and Selecting the Feedforward Capacitor
          2. 8.2.1.2.2 Negative Charge Pump
          3. 8.2.1.2.3 Positive Charge Pump
            1. 8.2.1.2.3.1 Voltage Doubler Mode
            2. 8.2.1.2.3.2 Voltage Tripler Mode
          4. 8.2.1.2.4 VCOM Buffer
          5. 8.2.1.2.5 Linear Regulator Controller
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Supply for a Typical Approximately 8-inch Display
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.