SLVS496D SEPTEMBER   2003  – August 2016 TPS65100 , TPS65101 , TPS65105

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Ratings
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Main Boost Converter
      2. 8.3.2  VCOM Buffer
      3. 8.3.3  Enable and Power-On Sequencing
      4. 8.3.4  Positive Charge Pump
      5. 8.3.5  Negative Charge Pump
      6. 8.3.6  Linear Regulator Controller
      7. 8.3.7  Soft Start
      8. 8.3.8  Fault Protection
      9. 8.3.9  Thermal Shutdown
      10. 8.3.10 Linear Regulator Controller
    4. 8.4 Device Functional Modes
      1. 8.4.1 Enable and Disable
      2. 8.4.2 Fault Mode
        1. 8.4.2.1 Overvoltage Protection
        2. 8.4.2.2 Short-Circuit Protection
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Boost Converter Design Procedure
          1. 9.2.2.1.1 Inductor Selection
          2. 9.2.2.1.2 Output Capacitor Selection
          3. 9.2.2.1.3 Input Capacitor Selection
          4. 9.2.2.1.4 Rectifier Diode Selection
          5. 9.2.2.1.5 Converter Loop Design and Stability
          6. 9.2.2.1.6 Design Procedure Quick Steps
          7. 9.2.2.1.7 Setting the Output Voltage and Selecting the Feedforward Capacitor
        2. 9.2.2.2 Negative Charge Pump
        3. 9.2.2.3 Positive Charge Pump
        4. 9.2.2.4 VCOM Buffer
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Notebook Supply
      2. 9.3.2 Monitor Supply
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Performance
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resource
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • PWP|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.