SLVSBB2F May   2012  – August 2024 TPS65131-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Conversion
      2. 7.3.2 Control
      3. 7.3.3 Output Rails Enable or Disable
      4. 7.3.4 Load Disconnect
      5. 7.3.5 Soft Start
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Undervoltage Lockout
      8. 7.3.8 Overtemperature Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS65131-Q1 With VPOS = 10.5V, VNEG = –10V
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Programming the Output Voltage
          1. 8.2.3.1.1 Boost Converter
          2. 8.2.3.1.2 Inverting Converter
          3. 8.2.3.1.3 Inductor Selection
        2. 8.2.3.2 Capacitor Selection
          1. 8.2.3.2.1 Input Capacitor
          2. 8.2.3.2.2 Output Capacitors
        3. 8.2.3.3 Rectifier Diode Selection
        4. 8.2.3.4 External P-MOSFET Selection
        5. 8.2.3.5 Stabilizing the Control Loop
          1. 8.2.3.5.1 Feedforward Capacitors
          2. 8.2.3.5.2 Compensation Capacitors
      4. 8.2.4 Analog Supply Input Filter
        1. 8.2.4.1 RC-Filter
        2. 8.2.4.2 LC-Filter
      5. 8.2.5 Thermal Information
      6. 8.2.6 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.4 Electrostatic Discharge Caution

TPS65131-Q1 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.