SLVSBB2F May   2012  – August 2024 TPS65131-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Conversion
      2. 7.3.2 Control
      3. 7.3.3 Output Rails Enable or Disable
      4. 7.3.4 Load Disconnect
      5. 7.3.5 Soft Start
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Undervoltage Lockout
      8. 7.3.8 Overtemperature Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 TPS65131-Q1 With VPOS = 10.5V, VNEG = –10V
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Programming the Output Voltage
          1. 8.2.3.1.1 Boost Converter
          2. 8.2.3.1.2 Inverting Converter
          3. 8.2.3.1.3 Inductor Selection
        2. 8.2.3.2 Capacitor Selection
          1. 8.2.3.2.1 Input Capacitor
          2. 8.2.3.2.2 Output Capacitors
        3. 8.2.3.3 Rectifier Diode Selection
        4. 8.2.3.4 External P-MOSFET Selection
        5. 8.2.3.5 Stabilizing the Control Loop
          1. 8.2.3.5.1 Feedforward Capacitors
          2. 8.2.3.5.2 Compensation Capacitors
      4. 8.2.4 Analog Supply Input Filter
        1. 8.2.4.1 RC-Filter
        2. 8.2.4.2 LC-Filter
      5. 8.2.5 Thermal Information
      6. 8.2.6 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data
    2. 11.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.5 Thermal Information

Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires special attention to power dissipation. Many system-dependent issues, such as thermal coupling, airflow, added heatsinks and convection surfaces, and the presence of heat-generating components affect the power-dissipation limits of a given component.

Three basic approaches for enhancing thermal performance follow.

  • Improving the power dissipation capability of the PCB design
  • Improving the thermal coupling of the component to the PCB
  • Introducing airflow to the system

The recommended device junction temperature range, TJ, is –40°C to 125°C. The thermal resistance of the 24-pin QFN, 4–mm × 4–mm package (RGE) is RθJA = 34.1°C/W. The recommended operating ambient temperature range for the device is TA = –40°C to 105°C. Use Equation 13 to calculate the maximum power dissipation, PDmax, as a function of TA. In this equation, use TJ = 125°C to operate the device within the recommended temperature range, use TJ = T(TS) to determine the absolute maximum threshold when the device might go into thermal shutdown. If the maximum ambient temperature of the application is lower, more heat dissipation is possible.

Equation 13. TPS65131-Q1