SLVS493E March   2004  – April 2022 TPS65130 , TPS65131

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Conversion
      2. 7.3.2 Control
      3. 7.3.3 Enable
      4. 7.3.4 Load Disconnect
      5. 7.3.5 Soft-Start
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Undervoltage Lockout
      8. 7.3.8 Overtemperature Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Save Mode
      2. 7.4.2 Full Operation with VIN > 2.7 V
      3. 7.4.3 Limited Operation with VUVLO < VIN < 2.7 V
      4. 7.4.4 No Operation with VIN < VUVLO
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programming the Output Voltage
          1. 8.2.2.1.1 Boost Converter
          2. 8.2.2.1.2 Inverting Converter
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Capacitor Selection
          1. 8.2.2.3.1 Input Capacitor
          2. 8.2.2.3.2 Output Capacitors
        4. 8.2.2.4 Rectifier Diode Selection
        5. 8.2.2.5 External PMOS Selection
        6. 8.2.2.6 Stabilizing the Control Loop
          1. 8.2.2.6.1 Feedforward Capacitor
          2. 8.2.2.6.2 Compensation Capacitors
      3. 8.2.3 Analog Supply Filter
        1. 8.2.3.1 RC-Filter
        2. 8.2.3.2 LC-Filter
      4. 8.2.4 Application Curves
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.5 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.