SLVS497F SEPTEMBER   2003  – June 2016 TPS65140 , TPS65141 , TPS65145

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Main Boost Converter
      2. 7.3.2 Power Good Output
      3. 7.3.3 Enable and Power-On Sequencing (EN, ENR)
      4. 7.3.4 Positive Charge Pump
      5. 7.3.5 Negative Charge Pump
      6. 7.3.6 Linear Regulator Controller
      7. 7.3.7 Soft Start
      8. 7.3.8 Fault Protection
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enabling and Disabling the Device
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Boost Converter Design Procedure
          1. 8.2.2.1.1  Inductor Selection
          2. 8.2.2.1.2  Output Capacitor Selection
          3. 8.2.2.1.3  Input Capacitor Selection
          4. 8.2.2.1.4  Rectifier Diode Selection
          5. 8.2.2.1.5  Converter Loop Design and Stability
          6. 8.2.2.1.6  Design Procedure Quick Steps
          7. 8.2.2.1.7  Setting the Output Voltage and Selecting the Feedforward Capacitor
          8. 8.2.2.1.8  Compensation
          9. 8.2.2.1.9  Negative Charge Pump
          10. 8.2.2.1.10 Positive Charge Pump
          11. 8.2.2.1.11 Linear Regulator Controller
      3. 8.2.3 Application Curves
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • PWP|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

For all switching power supplies, the layout is an important step in the design, especially at high-peak currents and switching frequencies. If the layout is not carefully designed, the regulator might show stability and EMI problems. TI recommends the following PCB layout guidelines for the TPS6514x devices:

  • Connect PGND and AGND together on the same ground plane.
  • Connect all capacitor grounds and PGND together on a common ground plane.
  • Place the input filter capacitor as close as possible to the input pin of the IC.
  • Route first the traces carrying high-switching currents with wide and short traces.
  • Isolate analog signal paths from power paths.
  • If vias are necessary, try to use more than one in parallel to decrease parasitics, especially for power traces.
  • Solder the thermal pad to the PCB for good thermal performance

10.2 Layout Example

TPS65140 TPS65141 TPS65145 LayoutRGE.gif Figure 26. PCB Layout Example

10.3 Thermal Considerations

An influential component of the thermal performance of a package is board design. To take full advantage of the heat dissipation abilities of the PowerPAD or VQFN package with exposed thermal die, a board that acts similar to a heatsink and allows for the use of an exposed (and solderable) deep downset pad must be used. For further information, see Texas Instruments application notes PowerPAD Thermally Enhanced Package and Power Pad Made Easy. For the VQFN package, see the application report QFN/SON PCB Attachement. Especially for the VQFN package, it is required to solder down the thermal pad to achieve the required thermal resistance.