SLVS497F SEPTEMBER 2003 – June 2016 TPS65140 , TPS65141 , TPS65145
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
MIN | MAX | UNIT | |
---|---|---|---|
Voltages on pin VIN(2) | –0.3 | 6 | V |
Voltages on pin VO1, SUP, PG (2) | –0.3 | 15.5 | V |
Voltages on pin EN, MODE, ENR(2) | –0.3 | VI+ 0.3 | V |
Voltage on pin SW(2) | 20 | V | |
Power good maximum sink current (PG) | 1 | mA | |
Continuous power dissipation | See Dissipation Ratings | ||
Lead temperature (soldering, 10 s) | 260 | °C | |
Operating junction temperature, TJ | –40 | 150 | °C |
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
VI | Input voltage | 2.7 | 5.8 | V | |
L | Inductor(1) | 4.7 | µH | ||
TA | Operating ambient temperature | –40 | 85 | °C | |
TJ | Operating junction temperature | –40 | 125 | °C |
THERMAL METRIC(1) | TPS6514x | UNIT | ||
---|---|---|---|---|
PWP (HTSSOP) | RGE (VQFN) | |||
24 PINS | 24 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 37.2 | 34.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 18.9 | 35.5 | °C/W |
RθJB | Junction-to-board thermal resistance | 16.4 | 11.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.4 | 0.4 | °C/W |
ψJB | Junction-to-board characterization parameter | 16.2 | 11.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 2.1 | 3.2 | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
SUPPLY CURRENT | ||||||
VI | Input voltage | 2.7 | 5.5 | V | ||
IQ | Quiescent current into VIN | ENR = GND, VO3 = 2 × VO1, Boost converter not switching |
0.7 | 0.9 | mA | |
IQCharge | Charge pump quiescent current into SUP | VO1 = SUP = 10 V, VO3 = 2 × VO1 | 1.7 | 2.7 | mA | |
VO1 = SUP = 10 V, VO3 = 3 × VO1 | 3.9 | 6 | ||||
IQEN | LDO controller quiescent current into VIN | ENR = VIN, EN = GND | 300 | 800 | μA | |
ISD | Shutdown current into VIN | EN = ENR = GND | 1 | 10 | μA | |
VUVLO | Undervoltage lockout threshold | VI falling | 2.2 | 2.4 | V | |
Thermal shutdown | Temperature rising | 160 | °C | |||
LOGIC SIGNALS EN, ENR | ||||||
VIH | High level input voltage | 1.5 | V | |||
VIL | Low level input voltage | 0.4 | V | |||
II | Input leakage current | EN = GND or VIN | 0.01 | 0.1 | µA | |
MAIN BOOST CONVERTER | ||||||
VO1 | Output voltage | 5 | 15 | V | ||
VO1 – VIN | Minimum input to output voltage difference | 1 | V | |||
VREF | Reference voltage | 1.205 | 1.213 | 1.219 | V | |
VFB | Feedback regulation voltage |
1.136 | 1.146 | 1.154 | V | |
IFB | Feedback input bias current |
10 | 100 | nA | ||
rDS(on) | N-MOSFET ON-resistance (Q1) | VO1 = 10 V, ISW = 500 mA | 195 | 290 | mΩ | |
VO1 = 5 V, ISW = 500 mA | 285 | 420 | ||||
ILIM | N-MOSFET switch current limit (Q1) | TPS65140, TPS65141 | 1.6 | 2.3 | 2.6 | A |
TPS65145 | 0.96 | 1.37 | 1.56 | A | ||
rDS(on) | P-MOSFET ON-resistance (Q2) | VO1 = 10 V, ISW = 100 mA | 9 | 15 | Ω | |
VO1 = 5 V, ISW = 100 mA | 14 | 22 | ||||
IMAX | Maximum P-MOSFET peak switch current | 1 | A | |||
ILEAK | Switch leakage current | VSW = 15 V | 1 | 10 | µA | |
fSW | Oscillator frequency | 0°C ≤ TA ≤ 85°C | 1.295 | 1.6 | 2.1 | MHz |
–40°C ≤ TA ≤ 85°C | 1.191 | 1.6 | 2.1 | |||
Line regulation | 2.7 V ≤ VI ≤ 5.7 V; ILOAD = 100 mA | 0.012 | %/V | |||
Load regulation | 0 mA ≤ IO ≤ 300 mA | 0.2 | %/A | |||
NEGATIVE CHARGE PUMP VO2 | ||||||
VO2 | Output voltage | –2 | V | |||
VREF | Reference voltage | 1.205 | 1.213 | 1.219 | V | |
VFB | Feedback regulation voltage |
–36 | 0 | 36 | mV | |
IFB | Feedback input bias current |
10 | 100 | nA | ||
rDS(on) | Q8 P-Channel switch rDS(on) | IO = 20 mA | 4.3 | 8 | Ω | |
Q9 N-Channel switch rDS(on) | 2.9 | 4.4 | ||||
IO | Maximum output current | 20 | mA | |||
Line regulation | 7 V ≤ VO1 ≤ 15 V, ILOAD = 10 mA, VO2 = –5 V |
0.09 | %/V | |||
Load regulation | 1 mA ≤ IO ≤ 20 mA, VO2 = –5 V | 0.126 | %/mA | |||
POSITIVE CHARGE PUMP VO3 | ||||||
VO3 | Output voltage | 30 | V | |||
VREF | Reference voltage | 1.205 | 1.213 | 1.219 | V | |
VFB | Feedback regulation voltage |
1.187 | 1.214 | 1.238 | V | |
IFB | Feedback input bias current |
10 | 100 | nA | ||
rDS(on) | Q3 P-Channel switch rDS(on) | IO = 20 mA | 9.9 | 15.5 | Ω | |
Q4 N-Channel switch rDS(on) | 1.1 | 1.8 | ||||
Q5 P-Channel switch rDS(on) | 4.6 | 8.5 | ||||
Q6 N-Channel switch rDS(on) | 1.2 | 2.2 | ||||
VD | D1 – D4 Shottky diode forward voltage |
ID1 – D4 = 40 mA | 610 | 720 | mV | |
IO | Maximum output current | 20 | mA | |||
Line regulation | 10 V ≤ VO1 ≤ 15 V, ILOAD = 10 mA, VO3 = 27 V |
0.56 | %/V | |||
Load regulation | 1 mA ≤ IO ≤ 20 mA, VO3 = 27 V | 0.05 | %/mA | |||
LINEAR REGULATOR CONTROLLER VO4 | ||||||
VO4 | Output voltage | 4.5 V ≤ VI ≤ 5.5 V; 10 mA ≤ IO ≤ 500 mA | 3.2 | 3.3 | 3.4 | V |
IBASE | Maximum base drive current |
VIN – VO4 – VBE ≥ 0.5 V(1) | 13.5 | 19 | mA | |
VIN – VO4 – VBE ≥ 0.75 V (1) | 20 | 27 | ||||
Line regulation | 4.75 V ≤ VI ≤ 5.5 V, ILOAD = 500 mA | 0.186 | %/V | |||
Load regulation | 1 mA ≤ IO ≤ 500 mA, VI = 5 V | 0.064 | %/A | |||
Start-up current | VO4 ≤ 0.8 V | 11 | 20 | 25 | mA | |
SYSTEM POWER GOOD (PG) | ||||||
V(PG, VO1) | Power good threshold(2) | –12 | –8.75% VO1 | –6 | V | |
V(PG, VO2) | –13 | –9.5% VO2 | –5 | V | ||
V(PG, VO3) | –11 | –8% VO3 | –5 | V | ||
VOL | PG output low voltage | I(sink) = 500 μA | 0.3 | V | ||
IL | PG output leakage current | VPG = 5 V | 0.001 | 1 | µA |
PACKAGE | RθJA | TA ≤ 25°C POWER RATING | TA = 70°C POWER RATING | TA = 85°C POWER RATING |
---|---|---|---|---|
24-Pin TSSOP | 30.13 C°/W (PWP soldered) | 3.3 W | 1.83 W | 1.32 W |
24-Pin VQFN | 30 C°/W | 3.3 W | 1.8 W | 1.3 W |