SLVSBG2A September   2013  – June 2016 TPS65154

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Simplified System Diagram
  2. 2 Revision History
  3. 3 Pin Configuration and Functions
  4. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
  5. 5 Detailed Description
    1. 5.1 Overview
    2. 5.2 Functional Block Diagram
    3. 5.3 Feature Description
      1. 5.3.1  Linear Regulator (VCC)
        1. 5.3.1.1 Power-Up (Linear Regulator)
        2. 5.3.1.2 Power-Down (Linear Regulator)
        3. 5.3.1.3 Protection (Linear Regulator)
      2. 5.3.2  Boost Converter 1 (AVDD)
        1. 5.3.2.1 Power-Up (Boost Converter 1)
        2. 5.3.2.2 Power-Down (Boost Converter 1)
        3. 5.3.2.3 Protection (Boost Converter 1)
      3. 5.3.3  Boost Converter 2 (VGH)
        1. 5.3.3.1 Power-Up (Boost Converter 2)
        2. 5.3.3.2 Power-Down (Boost Converter 2)
        3. 5.3.3.3 Protection (Boost Converter 2)
      4. 5.3.4  Negative Charge Pump (VGL)
        1. 5.3.4.1 Power-Up (Negative Charge Pump)
        2. 5.3.4.2 Power-Down (Negative Charge Pump)
        3. 5.3.4.3 Protection (Negative Charge Pump)
      5. 5.3.5  Gate Voltage Shaping
      6. 5.3.6  Panel Discharge (XAO)
      7. 5.3.7  Reset Generator (RST)
      8. 5.3.8  Programmable VCOM
        1. 5.3.8.1 Operational Amplifier Performance
        2. 5.3.8.2 Power-Up (Programmable VCOM)
        3. 5.3.8.3 Power-Down (Programmable VCOM)
      9. 5.3.9  WLED Driver
        1. 5.3.9.1 WLED Boost Converter
        2. 5.3.9.2 Current Sinks
        3. 5.3.9.3 Protection
        4. 5.3.9.4 Enable and Start-Up
      10. 5.3.10 Undervoltage Lockout
    4. 5.4 Device Functional Modes
      1. 5.4.1 Dimming Modes
        1. 5.4.1.1 Direct Dimming
        2. 5.4.1.2 Phase-Shift Dimming
      2. 5.4.2 Power Sequencing
        1. 5.4.2.1 Power-Up
        2. 5.4.2.2 Power-Down
    5. 5.5 Programming
      1. 5.5.1 Configuration
        1. 5.5.1.1 General
          1. 5.5.1.1.1 I2C Interface
          2. 5.5.1.1.2 Slave Addresses
          3. 5.5.1.1.3 Write Protect
      2. 5.5.2 Programming Examples (Excluding VCOM)
        1. 5.5.2.1 Writing to a Single RAM Register
        2. 5.5.2.2 Writing to Multiple RAM Registers
        3. 5.5.2.3 Saving Contents of all RAM Registers to EEPROM
        4. 5.5.2.4 Reading from a Single RAM Register
        5. 5.5.2.5 Reading from a Single EEPROM Register
        6. 5.5.2.6 Reading from Multiple RAM Registers
        7. 5.5.2.7 Reading from Multiple EEPROM Registers
      3. 5.5.3 Programming Examples - VCOM
        1. 5.5.3.1 Writing a VCOM Value of 77h to WR
        2. 5.5.3.2 Writing a VCOM Value of 77h to IVR and WR
        3. 5.5.3.3 Reading a VCOM Value of 77h from WR
        4. 5.5.3.4 Reading a VCOM Value of 77h from IVR
    6. 5.6 Register Map
      1. 5.6.1 Configuration Registers (Excluding VCOM)
        1. 5.6.1.1  CONFIG (00h)
        2. 5.6.1.2  VCC (01h)
        3. 5.6.1.3  DLY1 (02h)
        4. 5.6.1.4  AVDD (03h)
        5. 5.6.1.5  FSW1 (04h)
        6. 5.6.1.6  SS2 (05h)
        7. 5.6.1.7  DLY2 (06h)
        8. 5.6.1.8  VGL (07h)
        9. 5.6.1.9  SS3 (08h)
        10. 5.6.1.10 DLY3 (09h)
        11. 5.6.1.11 VGH (0Ah)
        12. 5.6.1.12 SS4 (0Bh)
        13. 5.6.1.13 FSW3 (0Ch)
        14. 5.6.1.14 DLY4 (0Dh)
        15. 5.6.1.15 OVP (0Eh)
        16. 5.6.1.16 FDIM (OFh)
        17. 5.6.1.17 RESET (10h)
        18. 5.6.1.18 VDET (11h)
        19. 5.6.1.19 DLY6 (12h)
        20. 5.6.1.20 VMAX (13h)
        21. 5.6.1.21 VMIN (14h)
        22. 5.6.1.22 USER (15h)
        23. 5.6.1.23 CONTROL (FFh)
      2. 5.6.2 VCOM Registers
        1. 5.6.2.1 VCOM DATA (Slave Address 28h, Register Address 00h)
        2. 5.6.2.2 VCOM CONTROL (Slave Address 28h, Register Address 02h)
  6. 6 Application and Implementation
    1. 6.1 Application Information
    2. 6.2 Typical Application
      1. 6.2.1 Design Requirements
      2. 6.2.2 Detailed Design Procedure
        1. 6.2.2.1 External Component Selection
      3. 6.2.3 Application Curves
  7. 7 Power Supply Recommendations
  8. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Community Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

2 Revision History

Changes from * Revision (September 2013) to A Revision

  • Changed from data sheet to data manual formatGo
  • Added Device Information table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go